Spherical copper powder has low porosity and relative sliding friction factor, good expandability and ductility. Ultrafine copper powder has the advantages of large specific surface area, strong surface activity, high melting point, good magnetism, electrical and thermal conductivity, good light absorption and other advantages, and has its wide application in many fields.

Micron spherical copper powder is used to conduct electricity:
Conductive material
The electronic paste applied on the surface of conductors, dielectrics and insulators is an indispensable electrode material in the field of microelectronics. Micro-nano copper powder can be used to prepare these electrode materials, conductive coatings and conductive composite materials. In large-scale integrated circuits, ultra-fine thick film paste prepared from nano-copper powder can play an important role. In the electronics industry, micron-level copper powder can greatly improve the integration of circuit boards.

Due to the excellent electrical conductivity and low price of copper, micro-nano copper powder can also be used to replace precious metals as the internal electrode and terminal electrode material of multilayer ceramic capacitors, effectively reducing the cost of multilayer ceramic capacitors.

In addition, metal materials are also widely used in the field of printed electronics due to their excellent characteristics such as small particle size, low sintering temperature, and easy preparation of conductive inks.

Copper powder has the advantages of good conductivity and low price, and has broad application prospects in the field of conductive materials.