Nano metal copper powder is widely used in high-efficiency catalysts, conductive plasmas, ceramic materials, high conductivity, high specific strength alloys and solid lubricants due to its unique optical, electrical, magnetic, thermal and chemical properties.

Nano-aluminum, copper and nickel powders have highly activated surfaces and can be coated at temperatures below the melting point of the powder under oxygen-free conditions. This technology can be applied to the production of microelectronic devices, as a conductive coating on the surface of metals and non-metals.

Using nano-copper powder instead of precious metal powder to prepare electronic paste with superior performance can greatly reduce the cost. This technology can promote the further optimization of microelectronic processes.