The properties of flake silver powder are stable, and the particles are in surface or line contact, so the resistance is relatively low and the conductivity is good. Flake silver powder is one of the important materials for electronic components and is widely used in electronic components such as membrane switches, filters, carbon film potentiometers, tantalum capacitors, and semiconductor chip bonding.
The key process for preparing flake silver powder is ball milling. The process of ball milling is more complicated. The quality of flake silver powder's micro morphology, diameter-to-thickness ratio, and surface condition all depend on the ball milling process. The main influencing factors of ball milling include ball gradation, ball mill speed, ball-to-material ratio, ball milling time, type and amount of grinding aids, ball milling atmosphere, ball milling temperature and so on.
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