Al2O3 nanopowders spherical alpha Alumina for thermal conductive silicone

Because of its good viscosity, flexibility, good compression performance and excellent thermal conductivity, thermally conductive silica gel is often used as a heat dissipation filler for the IC substrates of electrical appliances such as communication equipment and computers.Common inorganic non-metallic thermally conductive insulating powder fillers include aluminum nitride, aluminum oxide, zinc oxide, beryllium oxide, silicon oxide, silicon carbide, boron nitride, etc.Among them, alumina not only has good insulation properties, but also its thermal conductivity is not low (normal temperature thermal conductivity is 30W/m·K), and it has been widely used in insulation products in the field of high voltage and UHV switch appliances.

Alumina particles with high thermal conductivity must themselves have a high degree of crystallinity and compactness. Alpha-phase alumina has a hexagonal structure, which is the densest structure among various alumina variants. Studies have shown that the higher the alpha phase of the alumina powder, the crystals are completely single crystals and spherical particles, and there are certain crystal planes. When filled in silica gel, a certain line contact and surface will appear when the particles are in contact with the particles. Contact, so the thermal conductivity of silica gel can be greatly improved.