Why silicon dioxide nano powder can be used for CMP?

Nano-silica has relatively low cost, andgood dispersibility, mechanical abrasion, high strength and adhesion, good film formation, high permeability, high weather and wear resistance, small particle size, hardness.  It also has the advantages of moderate, low viscosity, low adhesion, and easy cleaning after polishing. Thus it is a polishing material for CMP technology with excellent performance.

SiO2 nano particle is often used for precision polishing of metal, sapphire, monocrystalline silicon, glass-ceramics, light guide tube and other surfaces. The size of nano silicon oxide is below 100nm, which has a large specific surface area, high dispersibility and permeability, so the damage layer on the surface of the polished workpiece is extremely small; in addition, the hardness of silica nanoparticle is similar to that of silicon wafers. Therefore, it is also often used for polishing semiconductor silicon wafers.

The advantages of nano SiO2 powder in CMP application:

1. Polishing is the use of uniform nanoparticles of SiO2 and other materials, which will not cause physical damage to the processed parts, and the speed is fast. The use of particles such as colloidal silica with uniform and large particle size can achieve the purpose of high-speed polishing.

2. It does not corrode equipment and has high safety performance.

3. Achieve high flatness grinding processing.

4. Effectively reduce the surface scratches after polishing and reduce the surface roughness after polishing.