Hōʻike:
Code | B036-1 |
Inoa | Pauda Submicron Copper |
Kumukumu | Cu |
CAS No. | 7440-55-8 |
Ka nui o ka ʻāpana | 300nm |
Maʻemaʻe ʻāpana | 99.9% |
ʻAno Crystal | pōʻai |
Ka nana aku | Paleka palaka |
Pūʻolo | 100g, 500g, 1kg a i ʻole e like me ka makemake |
Nā noi kūpono | Hoʻohana nui ʻia i ka pauka metallurgy, nā huahana kalapona uila, nā mea uila, nā uhi metala, nā catalysts kemika, nā kānana, nā paipu wela a me nā ʻāpana electromechanical ʻē aʻe a me nā kahua mokulele uila. |
wehewehe:
ʻOi aku ka hopena o ka Copper Submicron Powders me ka oxygen ma mua o ke keleawe maʻamau;Hōʻike nā Copper Submicron Powders i nā waiwai kemika ma mua o ke keleawe maʻamau, a ke hoʻololi nei i nā waiwai i manaʻo ʻia, akā ʻaʻole hoʻololi nā mea nano i ke kūlana o ka mea.
ʻAʻole wale ia, hana pololei nā Copper Submicron Powders ma ka ʻili metala o nā ʻāpana mīkini, a ke pāʻani nei i ka hana i ka hoʻoponopono ʻana i ka ʻili o ka metala.Ma hope o ka hoʻokuʻu ʻia ʻana o ka wela e ka friction, hiki i ka huahana ke hoʻohana i kāna mau nano-characteristics e hoʻopili ai i ka ʻili metala, e hana i ka ʻili o ka ʻili o ka metala maʻemaʻe, a me ka hoʻolaha ʻana i ke kiʻi pale i hana ʻia ma ka ʻili metala e ʻoi aku ka ikaika a me ka maʻalahi, pēlā. e hooloihi ana i ka metala o ka mīkini.ʻO ke ola lawelawe a me ka hopena mālama ola.
Kūlana mālama:
E mālama ʻia nā Copper Submicron Powders i kahi maloʻo, ʻoluʻolu, ʻaʻole pono e hōʻike ʻia i ka lewa e pale aku i ka anti-tide oxidation a me ka agglomeration.
SEM & XRD :