Hōʻike:
Code | C962 |
Inoa | Nano Daimana Pauda |
Kumukumu | C |
CAS No. | 7782-40-3 |
Ka nui o ka ʻāpana | 80-100nm |
Maemae | 99% |
Ka nana aku | Hinahina |
Nui ʻē aʻe | 10nm, 30-50nm |
Pūʻolo | 1kg / ʻeke a i ʻole e like me ka makemake |
Nā noi kūpono | ʻO ka polishing a me ka lubrication, ka catalysis kemika, ka uhi ʻana i ka hui |
wehewehe:
Hoʻohana ʻia e hana i ka lāʻau paʻa a me ka resin i hoʻoikaika ʻia.Loaʻa i kēia noi nā hopena i ka hoʻomaikaʻi ʻana i ka conductivity thermal o nā mea, polymer degradation temperature, ikaika a me ke kūpaʻa ʻana.Hiki iā ia ke hoʻonui i kona ikaika ma 1 a 4 mau manawa a hoʻomaikaʻi nui i kona pale ʻana a me ka Tightness.
ʻO ka paʻa paʻakikī o Nano-diamond composite, ke kūpaʻa ʻaʻahu kiʻekiʻe, ke kūpaʻa wela a me ka pale ʻana i ka corrosion, a hiki ke hoʻohana ʻia no ka uhi ʻana i nā ʻili metala a me ka lāʻau, plastic, aniani a me nā mea ʻē aʻe.ʻO ka nano-composite plating matrix ka nui o ka nickel, copper, cobalt, etc. ʻO ka papa nickel-plated composite i loaʻa ka nano-diamond i hoʻohana ʻia ma ke ʻano he pale pale pale no nā disks a i ʻole nā poʻo magnetic.Ke hoʻohālikelike ʻia me ka plating maʻamau, ua hoʻonui ʻia kona paʻakikī e 50%, a ua hoʻonui nui ʻia kona pale ʻana..
Hiki ke hoʻomaikaʻi maikaʻi ke aniani optical me ke kiʻi ʻoniʻoni nano-diamond i ka hiki ke hoʻomaikaʻi maikaʻi i ka hiki o ke aniani optical ke pale aku i ka ʻinoʻino ʻana o ka ua, ka hoʻoneʻe ʻana o ke one, a me ka ʻōpala ma lalo o nā kūlana koʻikoʻi, ʻoiai i ka wela kiʻekiʻe a me nā wahi radiation, e like me ka hoʻoponopono missile.Hiki i ka uhi ke hoʻohana i ke kiʻiʻoniʻoni nano-diamond no ka pale.Eia kekahi, ʻoi aku ka maikaʻi o nā waiwai electrochemical nano-diamond a me ka haʻahaʻa haʻahaʻa haʻahaʻa loa, no laila hiki ke hoʻohana ʻia e like me ka puka makani no nā paipu microwave mana kiʻekiʻe.Mai kēia manaʻo, ua lilo ke kiʻi ʻoniʻoni nano-diamond i koho maikaʻi loa i ka hoʻomohala ʻana o ke alakaʻi missile e like me ke alakaʻi microwave a me ke alakaʻi infrared.
ʻO ka hoʻohui ʻana o ke daimana nano ʻaʻole wale e hoʻonui i ka microhardness o ka uhi ʻana, ʻoi aku ka hopena o ka hopena a me ka pale ʻana, akā, ʻoi aku ka paʻa o ka paʻa me ka substrate, a hoʻomaikaʻi nui i ke kūpaʻa corrosion, ka wai kū a me ka thermal conductivity.
Kūlana mālama:
Pono e mālama ʻia ka pauka daimana Nano i ka sila, e pale i ka māmā, kahi maloʻo.Maikaʻi ka mālama ʻana i ka lumi wela.
SEM: