Hōʻike:
Code | B036-3 |
Inoa | Pauda Submicron Copper |
Kumukumu | Cu |
CAS No. | 7440-55-8 |
Ka nui o ka ʻāpana | 800nm |
Maʻemaʻe ʻāpana | 99.9% |
ʻAno Crystal | pōʻai |
Ka nana aku | ʻulaʻula ʻulaʻula pauda |
Pūʻolo | 100g, 500g, 1kg a i ʻole e like me ka makemake |
Nā noi kūpono | Hoʻohana nui ʻia i ka pauka metallurgy, nā huahana kalapona uila, nā mea uila, nā uhi metala, nā catalysts kemika, nā kānana, nā paipu wela a me nā ʻāpana electromechanical ʻē aʻe a me nā kahua mokulele uila. |
wehewehe:
Loaʻa i ka Copper Submicron Powders kahi ʻāpana kikoʻī kikoʻī nui a me ka hana kiʻekiʻe, a he catalyst maikaʻi loa i nā ʻoihana metallurgical a me ka petrochemical.I ka hydrogenation a me ka dehydrogenation o kiʻekiʻe molecular kaumaha polymers, nano-copper pauda catalysts he kiʻekiʻe loa ka hana a me ke koho.ʻO ka pauka Nano-copper he mea hoʻoikaika maikaʻi i ka hana ʻana i nā fiber conductive e ka nui o ka polymerization acetylene.
ʻO Copper Submicron Powders kekahi o nā hiʻohiʻona noi no ka lubrication.ʻO ka pauka keleawe maikaʻi loa i hui pū ʻia me kahi ʻili paʻa, i kapa ʻia he papa pale maʻemaʻe, a laila e hōʻemi nui ai i ka friction a me ka ʻaʻahu.
Kūlana mālama:
E mālama ʻia nā Copper Submicron Powders i kahi maloʻo, ʻoluʻolu, ʻaʻole pono e hōʻike ʻia i ka lewa e pale aku i ka anti-tide oxidation a me ka agglomeration.
SEM & XRD