Hōʻike:
inoa | Nanoparticles huila keleawe kala |
Kumukumu | Ag-Cu |
Ka nui o nā ʻāpana | 20nm, 50nm, 80nm, 100nm, hiki ke hoʻololi |
Maemae | 99.9%+ |
Morphology | aneane pōʻai |
Ka nana aku | ʻO ka maʻamau ʻeleʻele a ʻeleʻele paha ma muli o ke ʻano kālā |
Nā noi kūpono | Ka hoomakaukau ana i ka solder paste., etc. No nā kikoʻī huahana hou aku, e ʻoluʻolu e kelepona mai iā mākou. |
wehewehe:
Ke hoʻohana ʻia ka pauka alloy nano-silver-copper ma ke ʻano he conductive paste, hiki ke mālama ʻia ka nui o ke kālā, a he mea pono ia i ka mālama ʻana i ke kaiapuni.
Hoʻopili: Hoʻopiha piha ʻia, ʻeke pālua anti-static, 100g, 200g, 500g i loko o kahi ʻeke a i ʻole e like me ka makemake.
Kūlana mālama:
Pono e hoʻopaʻa ʻia nā nanoparticles alloy Ag-Cu ma lalo o ka momi a mālama ʻia i nā kūlana maloʻo a maloʻo.Pono e pale i ka pili ea.
SEM & XRD :