TDS\Ka nui | 40nm | 70nm | 100nm | 200nm |
Morphology | pōʻai | |||
Maemae | Kumu metala 99.9% | |||
COA | Bi<=0.003% Sb<=0.001% As<=0.002% Sn<=0.001% Fe<=0.006% Ni<=0.005% Pb<=0.001% Zn<=0.002% | |||
SSA(m2/g) | 10-12 | 8-11 | 8-10 | 6-8 |
ʻOi aku ka nui (g/ml) | 0.19 | 0.20 | 0.21 | 0.22 |
'Oia'i'o (g/ml) | 8.9 | 8.9 | 8.9 | 8.9 |
Nui paʻi | 25g, 50g, 100g i kēlā me kēia ʻeke i nā ʻeke antistatic pālua, a i ʻole e like me ka makemake. | |||
Ka manawa hoʻouna | Ma ka waihona, hoʻouna i nā lā hana ʻelua. |
Hana ʻia ma ke ʻano he anti-biotic, anti-microbial, a me anti-fungal agent ke hoʻohui ʻia i nā plastics, nā uhi, a me nā textiles.
ʻO nā metala ikaika a me nā mea hao.
EMI pale.
Heat sink a me nā mea hoʻoheheʻe wela loa.
ʻO ka mea hoʻoheheʻe kūpono no nā hopena kemika a no ka synthesis o ka methanol a me ka glycol.
E like me ka sintering additives a me nā mea capacitor.
Hiki ke hoʻohana ʻia nā ʻīnika conductive a me nā pastes i loaʻa iā Cu nanoparticles i mea pani no nā metala hanohano maikaʻi loa i hoʻohana ʻia i nā mea uila i paʻi ʻia, nā hōʻike, a me nā noi kiʻi ʻoniʻoni lahilahi conductive.
ʻO ka hoʻoheheʻe ʻia ʻana o ka metala a me ka metala non-ferrous.
Ka hana ʻana o ka MLCC kūloko electrode a me nā mea uila ʻē aʻe i ka slurry uila no ka miniaturization o nā mea microelectronic.
E like me nā mea hoʻohui nanometal lubricant.
Pono e hoʻopaʻa ʻia nā nanoparticles keleawe (20nm bta coated Cu) i loko o nā ʻeke ʻeke.
Mālama ʻia i loko o ka lumi anuanu a maloʻo.
Mai ʻike i ka ea.
E mālama i ka wela kiʻekiʻe, nā kumu o ke ahi a me ke kaumaha.