No ke aha e hoʻohana ʻia ai ka pauka nano silicon dioxide no CMP?

ʻO ka Nano-silica ke kumu kūʻai haʻahaʻa, a me ka dispersibility maikaʻi, ka abrasion mechanical, ka ikaika kiʻekiʻe a me ka hoʻopili ʻana, ka hoʻokumu ʻana o ke kiʻiʻoniʻoni maikaʻi, ka permeability kiʻekiʻe, ka wā kiʻekiʻe a me ke kūpaʻa ʻana, ka liʻiliʻi liʻiliʻi, ka paʻakikī.Loaʻa iā ia nā mea maikaʻi o ka haʻahaʻa haʻahaʻa, haʻahaʻa viscosity, haʻahaʻa adhesion, a maʻalahi hoʻi ka hoʻomaʻemaʻe ma hope o ka poli.No laila he mea polishing ia no ka ʻenehana CMP me ka hana maikaʻi loa.

Hoʻohana pinepine ʻia ʻo SiO2 nano particle no ka polishing precision o ka metala, sapphire, monocrystalline silicon, aniani-ceramics, light guide tube a me nā mea ʻē aʻe.ʻO ka nui o ka nano silicon oxide aia ma lalo o 100nm, nona kahi ākea kikoʻī nui, ka dispersibility kiʻekiʻe a me ka permeability, no laila ʻoi aku ka liʻiliʻi o ka papa pōʻino ma ka ʻili o ka mea hana poni;Eia kekahi, ʻo ka paʻakikī o ka nanoparticle silica ua like ia me nā wafer silika.No laila, hoʻohana pinepine ʻia no ka hoʻoliʻi ʻana i nā wafer silika semiconductor.

ʻO nā pono o ka nano SiO2 pauka i ka noi CMP:

1. ʻO ka polishing ka hoʻohana ʻana i nā nanoparticles like ʻole o SiO2 a me nā mea ʻē aʻe, ʻaʻole ia e hōʻeha kino i nā ʻāpana i hana ʻia, a wikiwiki ka wikiwiki.ʻO ka hoʻohana ʻana i nā ʻāpana e like me ka silica colloidal me ka ʻaʻahu a me ka nui o nā ʻāpana nui hiki ke hoʻokō i ke kumu o ka polishing kiʻekiʻe.

2. ʻAʻole ia e corrode i nā mea hana a he hana palekana kiʻekiʻe.

3. Loaʻa i ka hana wili palahalaha kiʻekiʻe.

4. Hoʻemi pono i nā ʻili o ka ʻili ma hope o ka hoʻoliʻiliʻi ʻana a hoʻemi i ka ʻili o ka ʻili ma hope o ka polishing.