inoa huahana | Nā kikoʻī |
Conductive flake Cu micron nui keleawe pauda kumu kūʻai | kala: ʻeleʻele Nui ʻāpana: 5-6um Maʻemaʻe: 99% Morphology: flake MOQ: 1kg |
Noi opāpaʻi Cu micron nui keleawe pauda
I ka ʻoihana uila, ʻo ka pauka keleawe maikaʻi loa ka mea hoʻonaninani conductive maikaʻi loa, nā mea electrode, ka hana ʻana o ka multi-layer ceramic capacitors terminal a me nā electrodes kūloko, nā mea uila o ka slurry packaging electronic, etc. a me nā loli nui i ka hana.
E like me ka mea hoʻolako nanoparticles metala, copper nanoparticles supplir, Ultrafine copper powder, ultrafine silver poweder, etc.
Puke & HoounaHoʻohana mākou i ʻeke anti-static pālua no nā kauoha liʻiliʻi liʻiliʻi
A me nā pahu no nā batchorders.
Loaʻa iā mākou nā mea hoʻouna: EMS, Fedex, DHL, TNT, UPS, etc
ʻO kā mākou lawelawePane wikiwiki no nā nīnau, nā leka a me nā leka uila, i loko o 24 mau hola. ʻO ka lawelawe ʻo Andcustomize no ka conductive flake micron copper powder he OK.
ʻIkepili HuiHana ʻo HW material Technology i nā mea nano i kā mākou mea kūʻai honua mai ka makahiki 2002, a ua loaʻa iā mākou ka ʻenehana hana kiʻekiʻe a me ka mana koʻikoʻi. Ma ke ʻano he mea hana a mea hoʻolako, hāʻawi mākou i nā huahana maikaʻi, kumukūʻai hoʻokūkū a me ka lawelawe ʻoihana.
No ka pauka keleawe, loaʻa iā mākou ka pauka keleawe spherical a flake, a hāʻawi ʻia ka lawelawe hana, hoʻokipa e kipa i kā mākou pūnaewele a me ka nīnau, mahalo.
FAQ1. Loaʻa iā ʻoe nā mea ʻē aʻe ka nui o ka ʻāpana Copper Powder i hāʻawi ʻia?
ʻAe, loaʻa pū kekahi 1-2um, 3um, 5-6um, 7-8umis. 0.3um, 0.5um, 0.8um spherical keleawe pauda. Loaʻa pū ka pauka keleawe nano, ka pauka keleawe submicron ma ka hāʻawi.
2. Hiki iaʻu ke loaʻa mua ka pauka keleawe flake?
ʻAe, loaʻa ke kauoha hāpana, hoʻokipa i kāu nīnau.
3. Pehea ka lōʻihi e hiki mai ai ka pauka micron keleawe ma hope o ka hōʻoia ʻana i ke kauoha?
Hoʻonohonoho ʻia ka hoʻouna ʻana e hōʻoia i ka uku, a lawe ʻia ʻo 3 ~ 6 mau lā hana e hiki mai.
4.He aha ka manawa uku?
T/T, Western Union, Paypal
5. Loaʻa iā ʻoe ka pauda keleawe i uhi ʻia i ke kālā?
ʻAe, hāʻawi mākou iā Ag i uhi ʻia ʻo Cu i ka nui o nā mea i makemake ʻia, morphology a me ka ʻike kālā.