Nui | 20nm | |||
Morphology | pōʻai | |||
Maemae | kumu metala 99%+ | |||
COA | C<=0.085% Ca<=0.005% Mn<=0.007% S<=0.016%Si<=0.045% | |||
ʻĀpana uhi | ʻaʻohe | |||
Mea hoʻoheheʻe | wai deionized | |||
Ka nana aku | ʻeleʻele ma ke ʻano keke pulu | |||
Nui paʻi | 25g no kēlā me kēia ʻeke i loko o nā ʻeke antistatic vacuum, a i ʻole e like me ka makemake. | |||
Ka manawa hoʻouna | Ma ka waihona, hoʻouna i nā lā hana ʻelua. |
ʻO ka hoʻoheheʻe ʻana o ka mea hoʻoheheʻe conductive o ka metala a me ka metala non-ferrous;
Kiʻekiʻe-performance catalyst : Copper a me kāna mau nanoparticles alloy ua hoʻohana ʻia e like me nā catalysts me ka hana kiʻekiʻe a me ka koho ikaika.Hiki ke hoʻohana ʻia lākou e like me nā catalysts i ka synthesis o ka methanol mai carbon dioxide a me ka hydrogen.
Cu Nanoparticles i hoʻohana 'ia e like me Conductive coatings;Inika conductive;Conductive slurry: Hiki ke hoʻohana ʻia ka nanopowder keleawe i ka hana ʻana o ka MLCC kūloko electrode a me nā mea uila ʻē aʻe i ka slurry uila no ka miniaturization o nā mea microelectronic;ʻO ka nui uila me ka hana maikaʻi i hana ʻia me ka nanopowder keleawe ma kahi o nā ʻāpana metala waiwai e ʻoki i ke kumukūʻai i ka nui;Hoʻohana ʻia kēia ʻenehana i ka makemake o nā kaʻina microelectronic;ʻO nā paʻi hoʻokele.Cu Nanoparticles mea kiʻekiʻe thermal conductivity mea.
Nā mea hoʻohui Nano Lubricant: Hoʻohui i ka 0.1 ~ 0.6% o ka nanopowder keleawe i ka ʻaila lubricant a me ka momona momona.E hana ia i kahi kiʻiʻoniʻoni hoʻoheheʻe ponoʻī a hoʻoponopono ponoʻī i loko o ka ʻili friction a hoʻohaʻahaʻa i kāna hana anti-friction a me ka hana anti-wear.
Mea hoʻohui lāʻau lapaʻau;
ʻO nā mea capacitor;
Pono e hoʻopaʻa ʻia nā nanoparticles keleawe (20nm bta coated Cu) i loko o nā ʻeke ʻeke.
Mālama ʻia i loko o kahi lumi maloʻo a maloʻo, ʻōlelo ʻia 0-10 ℃.
Mai ʻike i ka ea.
E mālama i ka wela kiʻekiʻe, ka lā a me ke kaumaha.