inoa mea | Cu Copper Nanoparticles/ Copper Powder |
Maʻemaʻe(%) | 99.9%,99% |
ʻO ke ʻano | Pada Poe ʻeleʻele |
Nui ʻāpana | 20nm 40nm 70nm 100nm 200nm |
Morphology | poepoe, kokoke spheriacl, dendritic, flake |
Papa Kūlana | Papa Hana Hana |
Nānā: e like me nā koi o ka mea hoʻohana o ka nano particle hiki ke hāʻawi i nā huahana nui like ʻole.
Palapala noio ka pauda keleawe:
1.Nano copper pauda forconductive paste: no ka MLCC terminal a me loko electrodes, miniaturization o microelectronic mea.Me kāna mau koho ʻē aʻe i ka hoʻomākaukau ʻana i ka pauka metala maikaʻi loa o ka slurry uila, hiki ke hōʻemi nui i nā kumukūʻai a hoʻopaʻa i ke kaʻina microelectronics.
2. Copper Powder no Metal nanoparticle momona mea hoʻohui: hoʻohui i ka aila lubricant aiʻole lubricant momona, i loko o ka papa o ka friction e hana ia iho-lubricating, a me ka hooponopono ana iho coatings i loko o ka ili friction, e maopopo leʻa i ka hiki o ka antiwear.Hoʻohui i nā nanopowder keleawe i nā ʻano mea metala mechanical friction lubricant e hana i ka ʻāpana o ka hoʻopaʻa ʻana i ka metala friction ponoʻī, mālama i ka ikehu a hoʻomaikaʻi i ke ola o nā mea hana a me ka manawa mālama.
3. E like me ka catalyst i hoʻohana 'ia ma ke kaʻina hana o carbon dioxide a me ka hydrogen a me ka methanol synthesis reaction.
No ka 20nm Copper nanoparticles he hana kiʻekiʻe, hāʻawi mākou i ka pauka keleawe nano nano no ka halihali palekana, aia kekahi hapa o ka wai deionized.ʻOi aku ka maʻalahi o ka hoʻopuehu ʻana i ka pauka keleawe nano.No ka 40nm Copper nanoparticle a i ʻole nā nui lager paricle ʻē aʻe, hiki ke koho ʻia ka pauka pulu a me ka pauka maloʻo no ke koho ʻana, akā ke aʻo aku nei mākou iā ʻoe e koho i ka pauka keleawe nano no ka lawe ʻana a me ke kumu hoʻopuehu.
Waihonao ka pauda keleawe:
Pono e hoʻopaʻa ʻia ka Copper Powder a mālama ʻia i loko o kahi wahi maloʻo maloʻo, mamao mai ka lā pololei.