Ua uhi ʻia ʻo Micron Ag Cu pauka conductive spherical / flake / dendritic

Loaʻa nā kiʻi SEM no Micron Ag i uhi ʻia ʻo Cu pauka conductive spherical / flake / dendritic.

E ʻoluʻolu e hoʻomaopopo ʻia no ka HW NANO Silver i uhi ʻia ʻo Cu, hiki ke hoʻololi ʻia ka ʻike Ag mai 3% - 30%, ʻoi aku ka kiʻekiʻe o ke kālā kālā, ʻoi aku ka maikaʻi o ka conductivity a me ke kumukūʻai kiʻekiʻe.A ʻo ka morphology no ka Ultrafine kala i uhi ʻia i ka pauka keleawe he flake / spherical / dendrical.

Ka noi a me ka pono o Micron Ag i uhi ʻia ʻo Cu pauka conductive spherical / flake / dendritic:

No ka conductive, loaʻa iā ia nā waiwai maikaʻi o ka pauka ultrafine Silve a ʻoiai ʻoi aku ka haʻahaʻa o ke keleawe i uhi ʻia.

Ma ke ʻano he mea pale pale EMI maikaʻi loa, ʻo ka pauka keleawe i uhi ʻia i ke kālā ke kumu kumu kumu kumu no nā kamaʻilio 5G, uila, ʻoihana koa, nā mea hana hale, AI, ikehu hou a me nā ʻoihana ʻē aʻe.ʻOi aku ka hopena o ka ʻike kālā ma ka waihoʻoluʻu a me ka conductivity o ka pauka keleawe i uhi ʻia i ke kālā.Ma ke kumumanaʻo, ʻoi aku ka maikaʻi o ka pale ʻana o ka oxidation i ka pauka keleawe i uhi ʻia me ke kālā kālā o 8wt%.ʻO ka hoʻohui ʻana i ka pena (pena), ke kāpili (adhesive), ka inika, ka polymer slurry, ka plastic, ka ʻōpala, hiki ke hana i nā huahana pale electromagnetic.

Hoʻopili a hoʻouna

Hoʻohana mākou i nā ʻeke anti-static pālua me ka pale maikaʻi i nā pahu pahu a no ka hoʻonohonoho ʻana i ka pahu e hoʻohana i nā pahu no ka pūʻolo.

No ka mea he ʻokoʻa nā mea kūʻai aku i ka contect kālā a me nā koi morphology no ka pauka keleawe i uhi ʻia i ke kālā, no laila ua hana ʻia ka huahana ma nā kauoha a me MOQ 1kg.Hoʻopili ʻia 500g, 1kg i kēlā me kēia ʻeke a i ʻole e like me ka mea e koi ai ka mea kūʻai aku.ʻO ka maʻamau he 3 mau lā hana e hoʻonohonoho ai.

No ka hoʻouna ʻana aku i ke keleawe i uhi ʻia i ke kālā, hoʻohana mākou i ka Fedex, DHL, UPS, TNT, EMS, nā laina kūikawā a me nā mea ʻē aʻe.