nano daimana pauka <10nm 99% e ka Detonation no ke kumu kūʻai hale hana Thermal Conductive

ʻO ka wehewehe pōkole:

Hāʻawi pololei ka hale hana i ka pauka daimana nano, i hana ʻia e ke ʻano detontation, hiki ke hoʻohana ʻia no ka thermal conductive. ʻO Kina ka mea hana alakaʻi me ke kumukūʻai kūpono a me ka maikaʻi paʻa, lawelawe ʻoihana.


Huahana Huahana

ʻO ka wehewehe ʻana o Nano Diamond Powder

Inoa Nano Daimana Pauda
Kumukumu C
Nui ʻāpana <10nm
Maemae 99%
Morphology Pōpoʻo
Ka nana aku pauda hina

Hoʻolauna Huahana

Pauda nanoparticles daimana

 

Wahi a nā haʻawina, ma hope o ka PA66 (PA66) -type thermal composite material, 0.1% o ka nui o ka boron nitride i ka thermal composite material ua pani ʻia e nā nano -diamonds, e hoʻonui ka thermal conductivity o ka mea ma kahi o 25%. ʻO ka hui CARBODEON ma Finland ua hoʻomaikaʻi hou aku i ka hana o nā nano -diamonds a me nā polymers, ʻaʻole ia e mālama wale i ka hana thermal mua o ka mea, akā e hoʻemi ana hoʻi i ka hoʻohana ʻana i nā nano -diamonds e 70% i ka wā o ke kaʻina hana, e hōʻemi nui ana i ka hana. koina.

 

No nā mea me ka kiʻekiʻe o ka thermal conductivity, hiki ke hoʻopiha ʻia ka 1.5% o nā nano -diamonds i nā mea hoʻopihapiha hoʻomehana no 20% o ka nui, hiki ke hoʻomaikaʻi nui a hoʻomaikaʻi i ka conductivity thermal.

 

ʻAʻohe hopena o ka Nano -diamond heat -conducting fillers i ka hana insulation uila a me nā waiwai ʻē aʻe o ka mea, ʻaʻole ia e hoʻohana i ka mea hana. Hoʻohana nui ʻia ia i nā ʻoihana uila a me nā mea LED.

 

 

nano daimana

  • Mua:
  • Aʻe:

  • E hoʻouna i kāu leka iā mākou:

    E kākau i kāu leka ma aneʻi a hoʻouna mai iā mākou

    E hoʻouna i kāu leka iā mākou:

    E kākau i kāu leka ma aneʻi a hoʻouna mai iā mākou