Hōʻike:
Code | C960 |
inoa | Nano Daimana Pauda |
Kumukumu | C |
CAS No. | 7782-40-3 |
Nui ʻāpana | <100nm |
Maemae | 99% |
Ka nana aku | Pauda hina |
Pūʻolo | 10g, 50g, 100g, 500g etc, i nā ʻeke anti-static pālua |
Nā noi kūpono | Thermal conductive, polishing, catalyst, etc |
wehewehe:
Hiki i ka thermal conductivity o daimana i 2000W/(m·K), ʻoi aku ka haʻahaʻa ma mua o ka graphene, akā ʻoi aku ka kiʻekiʻe ma mua o nā mea ʻē aʻe.Lawe ʻo Graphene i ka uila, ʻoiai ʻaʻole e hoʻokele ke daimana i ka uila, a he mea hoʻokaʻawale ia, no laila ʻoi aku ka maikaʻi o ke daimana no nā noi insulating.
Loaʻa i ka Diamond nā waiwai thermophysical kūʻokoʻa (ultra-high thermal conductivity a me semiconductor chip-matched expansion coefficient), e hoʻolilo iā ia i mea makemake i ka substrate hoʻoheheʻe wela.Eia naʻe, ʻaʻole maʻalahi ka hoʻomākaukau ʻana i hoʻokahi daimana i loko o kahi poloka, a ʻo ka paʻakikī o ke daimana he kiʻekiʻe loa, a paʻakikī ke hana ʻana i ka mea hao daimana.No laila, e hoʻohana ʻia ka noi kūpono i loko o ka mea hoʻoheheʻe wela ma ke ʻano o "mea hoʻohui i hoʻohui ʻia i ka metala matrix composite material" a i ʻole "CVD diamond/metal matrix composite material".ʻO nā mea matrix matrix maʻamau ka nui o Al, Cu a me Ag.
Wahi a ka noiʻi, ua ʻike ʻia ma hope o 0.1% o ka boron nitride maʻiʻo i loko o ka polyhexamethylene adipamide (PA66) type thermal composite material i hoʻololi ʻia me ka nano-diamond, e hoʻonui ʻia ka conductivity thermal o ka mea ma kahi o 25%.Ma ka hoʻomaikaʻi hou ʻana i nā waiwai o nā nano-diamonds a me nā polymers, ʻaʻole mālama wale ʻo Carbodeon i Finland i ka conductivity thermal mua o ka mea, akā e hōʻemi ana hoʻi i ka hoʻohana ʻana i nā nano-diamonds e like me 70% i ka wā o ke kaʻina hana, e hōʻemi nui ana i nā kumukūʻai hana. .
Ua hoʻomohala ʻia kēia mea hou thermal composite e ka Finnish VTT Technology Research Center a hoʻāʻo a hōʻoia ʻia e ka hui Kelemania ʻo 3M.
No nā mea me nā koi o ka thermal conductivity kiʻekiʻe, hiki ke hoʻomaikaʻi maikaʻi ʻia ka conductivity thermal ma ka hoʻopiha ʻana i ka 1.5% o nā nanodiamonds no 20% o ka mea hoʻopihapiha thermally conductive.
ʻAʻohe hopena o ka nano-diamond thermally conductive filler i nā waiwai insulation uila a me nā waiwai ʻē aʻe o ka mea, ʻaʻole ia e hoʻohana i nā mea hana, a hoʻohana nui ʻia i nā uila, nā mea hana LED a me nā māla ʻē aʻe.
Kūlana mālama:
Pono e hoʻopaʻa maikaʻi ʻia ka pauka daimana Nano, mālama ʻia ma kahi maloʻo a maloʻo, pale i ka mālamalama pololei.ʻO ka mālama ʻana i ka lumi wela he OK.