Conductive kala kala me ka maemaenā pauka kālā conductivehe mea hoʻopili polimer conductive, ʻo ia ka mea hoʻohui mīkini i haku ʻia me ka pauka kala conductive metala, resin base, solvent a me nā mea hoʻohui.

Conductive kala slurry i maikai uila conductivity a paʻa hana.ʻO ia kekahi o nā mea koʻikoʻi ma ka ʻenehana uila a me ka ʻenehana microelectronic.Hoʻohana nui ʻia ia i loko o nā ʻāpana uila uila quartz crystal circuit, hui ʻili ʻili kiʻi ʻoniʻoni mānoanoa, mea kani a me nā māla ʻē aʻe.

Ua hoʻokaʻawale ʻia nā ʻāpana kālā conductive i ʻelua mau ʻāpana:

1) Polymer silver conductive paste (i kālua ʻia a hoʻōla ʻia e hana i kahi kiʻiʻoniʻoni, me ka polymer organik ma ke ʻano o ka hoʻopaʻa ʻana);

2) Sintered silver conductive paste (sintering e hana i kiʻiʻoniʻoni, sintering wela ma luna o 500 ℃, aniani pauka a i ʻole oxide ma ke ʻano o ka hoʻopaʻa ʻana)

Pono nā ʻano ʻekolu o nā ʻāpana kalaiwa a i ʻole nā ​​hui like ʻole e like me nā mea hoʻopiha conductive, a ʻo nā ʻano hana like ʻole i kēlā me kēia ʻāpana e koi i nā ʻāpana Ag like ʻole e like me nā mea hana conductive.ʻO ke kumu o ka hoʻohana ʻana i ka liʻiliʻi loa o nā pauka Ag ma lalo o kekahi ʻano kumu a i ʻole ka hana kiʻiʻoniʻoni e hoʻokō i ka hoʻohana nui ʻana o ka uila a me ka thermal conductivity o Ag, e pili ana i ka optimization o ka hana kiʻiʻoniʻoni a me ke kumukūʻai.

Hoʻoholo nui ʻia ka conductivity o ka polymer e ka conductive filler silver powder, a ʻo ka nui o ia mea ke kumu hoʻoholo no ka hana conductive o ka paʻi kala conductive.Hiki ke hāʻawi ʻia ka mana o ka ʻike o ka pauka kālā i ka resistivity volume o ka paʻi kala conductive i nā hoʻokolohua he nui, ʻo ka hopena ʻo ka ʻike o ka ʻāpana kālā ka mea maikaʻi loa ma waena o 70% a 80%.Kūlike nā hopena hoʻokolohua i ke kānāwai.ʻO kēia ke kumu i ka liʻiliʻi o ka pauda kālā, liʻiliʻi ka liʻiliʻi o nā ʻāpana e pili ana kekahi i kekahi, a ʻaʻole maʻalahi ka hana ʻana o ka pūnaewele conductive;ke nui loa ka ʻike, ʻoiai ke kiʻekiʻe ka nui o ka pili ʻana i ka ʻāpana, liʻiliʻi ka ʻike resin, a paʻa ka resin e hoʻopili ana i nā ʻāpana kālā, e hoʻemi ʻia ka hopena pili, i hiki ai i ka manawa o nā ʻāpana e pili ana kekahi i kekahi ua hoemiia, a ua ilihune hoi ka pūnaewele conductive.Ke hiki i ka mea hoʻopiha piha i ka nui kūpono, ʻoi aku ka maikaʻi o ka conductivity o ka pūnaewele i ka resistivity liʻiliʻi a me ka conductivity nui loa. 

Kuhikuhi kumu hoʻokahi no conductive kala kala:

Kumu 1:

Nā mea hoʻohui

Pākēneka nuipa

wehewehe mea

ʻO ka pauka kālā Hongwu

75-82%

Mea hoʻopiha hoʻokō

Bisphenol A ʻano epoxy resin

8-12%

Resin

Acid anhydride curing agent

1-3%

mea paakiki

Methyl imidazole

0-1%

Mea hoʻokē

Butyl acetate

4-6%

Mea hoʻoheheʻe hana ʻole

Mea hoʻoheheʻe ikaika 692

1-2%

Mea hoʻoheheʻe ikaika

Tetraethyl titanate

0-1%

Mea hoʻolaha pili

Wax polyamide

0-1%

Mea kūʻē i ka hoʻoponopono

ʻO ke kumu kuhikuhi 2: ka pauka kala kalaiwa, E-44 epoxy resin, tetrahydrofuran, polyethylene glycol

Ka pauka kala: 70%-80%

Epoxy resin: tetrahydrofuran he 1: (2-3)

ʻO ka resin epoxy: ʻo ka lāʻau lapaʻau he 1.0: (0.2 ~ 0.3)

Epoxy resin: polyethylene glycol he 1.00: (0.05-0.10)

Nā mea hoʻoheheʻe kiʻekiʻe: butyl anhydride acetate, diethylene glycol butyl ether acetate, diethylene glycol ethyl ether acetate, isophorone

ʻO ka noi nui o ka haʻahaʻa haʻahaʻa a me ka maʻamau o ka mālama ʻana i ke kala kala: loaʻa iā ia nā hiʻohiʻona o ka haʻahaʻa haʻahaʻa haʻahaʻa, ka ikaika hoʻopaʻa kiʻekiʻe, ka hana uila paʻa, a kūpono hoʻi no ka paʻi ʻana i ka pale, ka uila a me ka hoʻopaʻa ʻana i ka wela i nā manawa maʻamau e mālama ai i ka wela, e like me quartz crystals, infrared pyroelectric detectors, piezoelectric ceramics, potentiometers, flash tubes and shielding, circuit repairs, etc.

ʻO ke koho o ka lāʻau lapaʻau e pili ana i ka mahana hoʻōla o ka resin epoxy.Hoʻohana mau ʻia nā polyamines a me nā polythiamines no ka mālama ʻana i nā mahana maʻamau, aʻo ka acid anhydride a me nā polyacids ma ke ʻano he lāʻau lapaʻau no ka mālama ʻana i nā wela kiʻekiʻe.ʻOkoʻa nā mea lapaʻau hoʻōla ʻokoʻa i nā ʻano hoʻololi kea.

Ka nui o ka lāʻau lapaʻau: inā he liʻiliʻi ka nui o ka lāʻau lapaʻau, e hoʻolōʻihi ʻia ka manawa hoʻōla a paʻakikī paha ke hoʻōla;inā ʻoi aku ka nui o ka lāʻau lapaʻau, e hoʻopilikia ia i ka conductivity o ka paʻi kālā a ʻaʻole kūpono i ka hana.

I loko o ka ʻōnaehana epoxy a me ka curing agent, pehea e koho ai i kahi diluent kūpono e pili ana i ka manaʻo o ka mea hoʻolālā formula, e like me ka noʻonoʻo ʻana: ke kumukūʻai, ka hopena dilution, ʻala, ka paʻakikī o ka ʻōnaehana, ka pale ʻana o ka ʻōnaehana, etc.

ʻO ka hoʻoheheʻe ʻana: inā he liʻiliʻi loa ke ʻano o ka diluent, e lohi ka wikiwiki o ka hoʻoheheʻe ʻana o ka resin a ʻoi aku ka liʻiliʻi o ka paʻi;inā ʻoi aku ka nui o ka dosage diluent, ʻaʻole kūpono ia i kona volatilization a me ka ho'ōla.

 

 


Ka manawa hoʻouna: Apr-21-2021

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