Hoʻohana ke ʻano detonation i ke kiʻekiʻe kiʻekiʻe koke (2000-3000K) a me ke kaomi kiʻekiʻe (20-30GPa) i hana ʻia e ka detonation pahū e hoʻohuli i ke kalapona i loko o ka mea pahū i nā daimana nano.ʻO ka nui o ka nui o ka daimana i hana ʻia ma lalo o 10nm, ʻo ia ka pauka daimana maikaʻi loa i loaʻa i nā ʻano āpau i kēia manawa.Nano-daimanaLoaʻa iā ia nā hiʻohiʻona ʻelua o ke daimana a me nā nanoparticles, a loaʻa iā ia nā hiʻohiʻona noi ākea ma nā kahua o ka electroplating, lubrication a me ka polishing maikaʻi.

Nā kahua noi o nā pauka daimana nano:

(1) Mea pale lole

I ka wā electroplating, hoʻohui i ka nui kūpono o ka nano-sized diamond powder i ka electrolyte e hoʻoemi i ka nui o ka palaoa o ka metala electroplated, a e hoʻonui nui ʻia ka microhardness a me ke kūpaʻa ʻana;

Hoʻohui kekahi poʻe i ka nano-diamond me ka copper-zinc, copper-tin powder, no ka mea, he mau hiʻohiʻona ka nano daimana i ka liʻiliʻi friction coefficient a me ke kiʻekiʻe thermal conductivity, ʻo ka mea i loaʻa he kiʻekiʻe ka pale ʻana a me ke kūpaʻa ʻana, a hiki ke hoʻohana ʻia no loko. nā liner cylinder combustion engine, etc.

(2) Mea lubricant

ʻO ka noi odaimana nanoi ka aila lubricating, grease a me ka coolant i hoʻohana nui ʻia i ka ʻoihana mīkini, ka hana metala, ka hana ʻenehana, ka hana moku, ka mokulele, ka halihali.ʻO ka hoʻohui ʻana i ke daimana nano i ka ʻaila lubricating hiki ke hoʻomaikaʻi i ke ola hana o ka ʻenekini a me ka hoʻoili ʻana a mālama i ka wahie ʻaila, hoʻemi ʻia ka friction torque e 20-40%, hoʻemi ʻia ke kapa friction ma 30-40%.

(3) Nā mea abrasive maikaʻi

ʻO ka wai wili a i ʻole ka poloka wili i hana ʻia me ka pauka nano-diamond hiki ke wili i ka ʻili me ka maʻalahi loa.Eia kekahi laʻana: Hiki ke hana i nā aniani X-ray me nā koi hoʻopau kiʻekiʻe loa;Hiki ke loaʻa ka ʻili me ka ʻili o ka ʻili he 0.013 μm wale nō ka wai wili me ka wai wili i loko o ka pauka nano-diamond.

(4) Nā hoʻohana ʻē aʻe o ka nano-diamond

ʻO ka hoʻohana ʻana i kēia pauka daimana i ka hana ʻana i nā mea photosensitive no ke kiʻi uila hiki ke hoʻomaikaʻi nui i ka hana o nā kope;

Ke hoʻohana nei i ka conductivity thermal kiʻekiʻe o ka nano-diamond, hiki ke hoʻohana ʻia e like me ka thermal conductive filler, thermal paste, etc.