TDS\Ka nui | Cu 300nm;Cu500nm;Cu800nm | |||
Helu CAS | 7440-50-8 | |||
Morphology | pōʻai | |||
Maemae | kumu metala 99%+ | |||
Ka nana aku | ʻulaʻula keleawe | |||
ʻAi Ili Kūikawā (BET) | 1-4m2/g hiki ke hoʻololi | |||
Nui paʻi | 100g, 500g, 1kg no kēlā me kēia ʻeke i nā ʻeke antistatic pālua, a i ʻole e like me ka makemake. | |||
Ka manawa hoʻouna | Ma ka waihona, hoʻouna i nā lā hana ʻelua. |
Hana ʻia ma ke ʻano he anti-biotic, anti-microbial, a me anti-fungal agent ke hoʻohui ʻia i nā plastics, nā uhi, a me nā textiles.
ʻO nā metala ikaika a me nā mea hao.
EMI pale.
Heat sink a me nā mea hoʻoheheʻe wela loa.
ʻO ka mea hoʻoheheʻe kūpono no nā hopena kemika a no ka synthesis o ka methanol a me ka glycol.
E like me ka sintering additives a me nā mea capacitor.
Hiki ke hoʻohana ʻia nā ʻīnika conductive a me nā pastes i loaʻa iā Cu nanoparticles i mea pani no nā metala hanohano maikaʻi loa i hoʻohana ʻia i nā mea uila i paʻi ʻia, nā hōʻike, a me nā noi kiʻi ʻoniʻoni lahilahi conductive.
ʻO ka hoʻoheheʻe ʻia ʻana o ka metala a me ka metala non-ferrous.
Ka hana ʻana o ka MLCC kūloko electrode a me nā mea uila ʻē aʻe i ka slurry uila no ka miniaturization o nā mea microelectronic.
E like me nā mea hoʻohui nanometal lubricant.
Pono e hoʻopaʻa ʻia nā nanoparticles keleawe (20nm bta coated Cu) i loko o nā ʻeke ʻeke.
Mālama ʻia i loko o ka lumi anuanu a maloʻo.
Mai ʻike i ka ea.
E mālama i ka wela kiʻekiʻe, nā kumu o ke ahi a me ke kaumaha.