CMP ejiri Silicon Dioxide Nanoparticle Nano SiO2 mee ihe maka nchacha igwe kemịkalụ

Nkọwa dị mkpirikpi:

Silica nanopowder nwere ezigbo dispersibility, n'ibu abrasion, elu ike na adhesion, ezi film e guzobere, elu permeability, elu ihu igwe na abrasion iguzogide, ọ bụ ezigbo polishing ihe onwunwe maka CMP.Silicon Dioxide Nanoparticle/ Nano SiO2 na-arụ ọrụ nke ọma na nchacha igwe kemịkalụ.


Nkọwa ngwaahịa

CMP ejiri Silicon Dioxide Nanoparticle Nano SiO2 mee ihe maka nchacha igwe kemịkalụ

Nkọwapụta:

Aha Silicon Dioxide/Silica/Silicon oxide Nanopowders
Usoro SiO2
Ụdị Hydrophobic, hydrophilic
Nha urughuru 20nm
Ịdị ọcha 99.8%
Ọdịdị Ọcha ntụ ntụ
ngwugwu 20kg / 30kg kwa akpa / gbọmgbọm
Ngwa nwere ike ime Ihe mkpuchi mmiri na-ekpuchi mmiri, polishing, roba, seramiiki, ihe, agba, nhicha onwe ya, antibacterial, catalyst, binder, lubricity, wdg.

Nkọwa:

Kedu ihe kpatara enwere ike iji silicon dioxide nano ntụ ntụ maka CMP?

Nano-silica nwere dịtụ ala na-eri, andgood dispersibility, n'ibu abrasion, elu ike na adhesion, ezi film e guzobere, elu permeability, elu ihu igwe na eyi iguzogide, obere urughuru size, ekweghị ekwe.Ọ nwekwara uru nke agafeghị oke, obere viscosity, ala adhesion, na mfe ihicha mgbe polishing.Ya mere ọ bụ ihe na-egbuke egbuke maka teknụzụ CMP nwere arụmọrụ dị mma.

A na-ejikarị SiO2 nano polishing nke metal, sapphire, monocrystalline silicon, glass-ceramics, tube nduzi ọkụ na ihe ndị ọzọ.The size nke nano silicon oxide dị n'okpuru 100nm, nke nwere a nnukwu kpọmkwem n'elu ebe, elu dispersibility na permeability, otú mmebi oyi akwa n'elu nke polished workpiece bụ nnọọ obere;na mgbakwunye, ike nke silica nanoparticle yiri nke silicon wafers.Ya mere, a na-ejikarị ya eme ihe maka polishing semiconductor silicon wafers.

 

Uru nke nano SiO2 ntụ ntụ na ngwa CMP:

1. Polishing bụ ojiji nke edo nanoparticles nke SiO2 na ihe ndị ọzọ, nke na-agaghị eme ka anụ ahụ mebiri na-esichara akụkụ, na ọsọ bụ ngwa ngwa.The ojiji nke ahụ dị ka colloidal silica na edo na nnukwu urughuru size nwere ike nweta nzube nke elu-ọsọ polishing.

2. Ọ naghị emebi akụrụngwa ma nwee arụmọrụ nchekwa dị elu.

3. Nweta elu flatness egweri nhazi.

4. Na-ebelata ihe nkedo nke ọma mgbe ọ na-egbukepụ egbukepụ ma belata nhụsianya elu mgbe ịchachara.

Ọnọdụ Nchekwa:

Silicon dioxide (SiO2) nanopowders kwesịrị ịchekwa na mkpuchi, zere ìhè, ebe akọrọ.Nchekwa okpomọkụ ụlọ dị mma.

SEM:

Mmanụ TEM-SiO2

 

FYI ngwugwu:

nano SiO2 nnukwu ngwugwu


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