Nkọwapụta:
Aha | Silicon Dioxide/Silica/Silicon oxide Nanopowders |
Usoro | SiO2 |
Ụdị | Hydrophobic, hydrophilic |
Nha urughuru | 20nm |
Ịdị ọcha | 99.8% |
Ọdịdị | Ọcha ntụ ntụ |
ngwugwu | 20kg / 30kg kwa akpa / gbọmgbọm |
Ngwa nwere ike ime | Ihe mkpuchi mmiri na-ekpuchi mmiri, polishing, roba, seramiiki, ihe, agba, nhicha onwe ya, antibacterial, catalyst, binder, lubricity, wdg. |
Nkọwa:
Kedu ihe kpatara enwere ike iji silicon dioxide nano ntụ ntụ maka CMP?
Nano-silica nwere dịtụ ala na-eri, andgood dispersibility, n'ibu abrasion, elu ike na adhesion, ezi film e guzobere, elu permeability, elu ihu igwe na eyi iguzogide, obere urughuru size, ekweghị ekwe.Ọ nwekwara uru nke agafeghị oke, obere viscosity, ala adhesion, na mfe ihicha mgbe polishing.Ya mere ọ bụ ihe na-egbuke egbuke maka teknụzụ CMP nwere arụmọrụ dị mma.
A na-ejikarị SiO2 nano polishing nke metal, sapphire, monocrystalline silicon, glass-ceramics, tube nduzi ọkụ na ihe ndị ọzọ.The size nke nano silicon oxide dị n'okpuru 100nm, nke nwere a nnukwu kpọmkwem n'elu ebe, elu dispersibility na permeability, otú mmebi oyi akwa n'elu nke polished workpiece bụ nnọọ obere;na mgbakwunye, ike nke silica nanoparticle yiri nke silicon wafers.Ya mere, a na-ejikarị ya eme ihe maka polishing semiconductor silicon wafers.
Uru nke nano SiO2 ntụ ntụ na ngwa CMP:
1. Polishing bụ ojiji nke edo nanoparticles nke SiO2 na ihe ndị ọzọ, nke na-agaghị eme ka anụ ahụ mebiri na-esichara akụkụ, na ọsọ bụ ngwa ngwa.The ojiji nke ahụ dị ka colloidal silica na edo na nnukwu urughuru size nwere ike nweta nzube nke elu-ọsọ polishing.
2. Ọ naghị emebi akụrụngwa ma nwee arụmọrụ nchekwa dị elu.
3. Nweta elu flatness egweri nhazi.
4. Na-ebelata ihe nkedo nke ọma mgbe ọ na-egbukepụ egbukepụ ma belata nhụsianya elu mgbe ịchachara.
Ọnọdụ Nchekwa:
Silicon dioxide (SiO2) nanopowders kwesịrị ịchekwa na mkpuchi, zere ìhè, ebe akọrọ.Nchekwa okpomọkụ ụlọ dị mma.
SEM: