Conductive Ag pani Cu Paura Micron Hiriwa pani Parahi paura mo Conductive Filler
Hua Spec
| Ingoa tūemi | Te paura parahi kua pania ki te Hiriwa |
| MF | Ag-Cu |
| Pure(%) | 99.9% |
| Te ahua | Powder |
| Te rahi o te matūriki | 1-3um, 5um, 8um |
| Te ahua kiriata | NA |
| Te takai | 1kg mo ia putea |
| Paerewa Paerewa | Koeke Ahumahi,Koeke Irahiko |
Mahinga Hua
TaupāngaoTe paura parahi kua pania ki te Hiriwa:
1. Whakapiri conductive.
2. Nga whakakikoruatanga whakahaere.
3. Polymer.
4. Whakapiri Conductive.
5. Ko te whakahaere i nga hiahia hiko o te hangarau microelectronics, ko nga mea whakahaere penei i te maimoatanga mata whakarewa, penei i te ahumahi, he momo hou o te paura hiato conductive.
6. Hikohiko.
7. Te ahumahi hoia me etahi atu waahanga ahumahi o te whakamarumaru hiko me te hiko.
8. Rorohiko, waea waea, arahiko whakauru, momo taputapu hiko katoa, taputapu hauora hiko, taputapu hiko me nga mita, me etahi atu, ka kore te hua i raro i te pokanoa hiko.
RokirokioTe paura parahi kua pania ki te Hiriwa:
Te paura parahi kua pania ki te Hiriwarme hiri me te rongoa i roto i te waahi maroke, hauhautanga, matara atu i te ra tika.
