Kufotokozera:
Dzina | Silver Copper Alloy Nanoparticles |
Fomula | Ag-Ku |
Kukula kwa Tinthu | 20nm, 50nm, 80nm, 100nm, chosinthika |
Chiyero | 99.9% + |
Morphology | pafupifupi yozungulira |
Maonekedwe | Nthawi zambiri imakhala yakuda kapena yakuda kutengera ndi siliva |
Ntchito zomwe zingatheke | Kukonzekera kwa solder phala., etc. Kuti mudziwe zambiri zamalonda, chonde titumizireni momasuka. |
Kufotokozera:
Pamene nano-silver-copper alloy powder amagwiritsidwa ntchito ngati phala la conductive, kuchuluka kwa siliva kumatha kupulumutsidwa, ndipo kumapindulitsa pachitetezo cha chilengedwe.
Kulongedza: Vacuum-packed, double-layer anti-static thumba, 100g, 200g, 500g m'thumba kapena pakufunika
Mkhalidwe Wosungira:
Ag-Cu alloy nanoparticles ayenera kusindikizidwa pansi pa vacuum ndipo ayenera kusungidwa pamalo ozizira komanso owuma.Kulumikizana ndi mpweya kuyenera kupewedwa.
SEM & XRD :