Chifukwa chiyani silicon dioxide nano ufa ingagwiritsidwe ntchito pa CMP?

Nano-silica ili ndi mtengo wochepa, komanso dispersibility wabwino, abrasion makina, mphamvu mkulu ndi adhesion, wabwino filimu mapangidwe, mkulu permeability, nyengo mkulu ndi kukana kuvala, yaing'ono tinthu kukula, kuuma.Lilinso ndi ubwino wapakatikati, kukhuthala kochepa, kumamatira pang'ono, komanso kuyeretsa kosavuta pambuyo popukuta.Chifukwa chake ndi zinthu zopukutira zaukadaulo wa CMP ndikuchita bwino kwambiri.

SiO2 nano particle nthawi zambiri amagwiritsidwa ntchito popukuta zitsulo, safiro, monocrystalline silicon, galasi-ceramics, chubu chowongolera kuwala ndi malo ena.Kukula kwa nano silicon okusayidi ndi pansi pa 100nm, yomwe ili ndi malo akuluakulu enieni, otsika kwambiri komanso ovomerezeka, kotero kuti zowonongeka zowonongeka pamwamba pa workpiece zopukutidwa ndizochepa kwambiri;Komanso, kuuma kwa silika nanoparticle n'kofanana ndi silicon wafers.Chifukwa chake, amagwiritsidwanso ntchito nthawi zambiri kupukuta ma semiconductor silicon wafers.

Ubwino wa nano SiO2 ufa mu CMP ntchito:

1. Kupukuta ndikugwiritsa ntchito ma nanoparticles a yunifolomu a SiO2 ndi zipangizo zina, zomwe sizingawononge thupi ku magawo okonzedwa, ndipo liwiro liri mofulumira.Kugwiritsa ntchito particles monga silika colloidal ndi yunifolomu ndi lalikulu tinthu kukula akhoza kukwaniritsa cholinga mkulu-liwiro kupukuta.

2. Siziwononga zida ndipo zimakhala ndi chitetezo chokwanira.

3. Kukwaniritsa mkulu flatness akupera processing.

4. Chepetsani bwino zokopa zapamtunda mutatha kupukuta ndi kuchepetsa kuuma kwapamwamba mutatha kupukuta.