TDS\Size | 40nm | 70nm | 100nm | 200nm |
Morphology | Spherical | |||
Kuchena | Metal hwaro 99.9% | |||
COA | Bi<=0.003% Sb<=0.001% As<=0.002% Sn<=0.001% Fe<=0.006% Ni<=0.005% Pb<=0.001% Zn<=0.002% | |||
SSA(m2/g) | 10-12 | 8-11 | 8-10 | 6-8 |
Bulk Density(g/ml) | 0.19 | 0.20 | 0.21 | 0.22 |
Chokwadi Density(g/ml) | 8.9 | 8.9 | 8.9 | 8.9 |
Kurongedza saizi | 25g, 50g, 100g pabhegi mumabhegi maviri antistatic, kana sezvinodiwa. | |||
Delivery nguva | Mune stock, kutumira mumazuva maviri ekushanda. |
Inoshanda seanti-biotic, anti-microbial, uye anti-fungal mumiriri kana yawedzerwa kumapurasitiki, machira, uye machira.
High simba masimbi uye alloys.
EMI kudzivirira.
Heat sinks uye yakanyanya kupisa conductive zvinhu.
Inoshanda catalyst yemakemikari maitiro uye ye synthesis yemethanol uye glycol.
Sezvo sintering additives uye capacitor zvinhu.
Conductive ingi nemanames ane Cu nanoparticles anogona kushandiswa sechinzvimbo chesimbi dzinodhura kwazvo dzinoshandiswa mumagetsi akadhindwa, zviratidziro, uye transmissive conductive dzakaonda firimu application.
Superficial conductive coating processing yesimbi uye isiri-ferrous simbi.
Kugadzirwa kweMLCC yemukati maelectrode uye zvimwe zvikamu zvemagetsi mumagetsi slurry kuitira miniaturization yemicroelectronic zvishandiso.
Sezvo nanometal lubricant additives.
Copper nanoparticles (20nm bta yakavharwa Cu) inofanirwa kuvharirwa mumabhegi ekutsvaira.
Kuchengetwa muimba inotonhorera uye yakaoma.
Usasangana nemhepo.
Ramba kure nekupisa kwakanyanya, masosi ekudzima uye kushushikana.