Using advanced electroless plating technology, an extremely thin silver plating layer is formed on the surface of ultra-fine copper powder. After a certain molding and treatment process, an ultra-fine powder with uniform particle size and excellent oxidation resistance is obtained. It is a highly conductive filler with a promising future. It can be made into conductive paint, ink, or mixed with rubber, plastic, fabric to form products with different conductive properties. It is widely used in industries such as microelectronics technology, electromagnetic shielding, and surface modification of non-conductive materials.
Silver-coated copper conductive powder, with different silver content (such as 5%, 10%, 15%, 20%, 30%, 35%, etc.), various shapes (such as flake, spherical, dendritic), and various particles Diameter (mainly larger than 1 micron particle size) silver-coated copper powder.