Lebitso la Sehlahiswa | Litlhaloso |
Diamond nano matla | MF: C Boholo ba likarolo: 10nm Bohloeki: 99% Morphology: chitja MOQ: 10g |
Mefuta e meng e fumanehang bakeng sa phofo ea diamond nano:
20-40nm, 99%
80-100nm, 99%
Dimaond nanopowder e ka sebelisoa bakeng sa lubricant.Litaemane tsa Nano li na le melemo e latelang ho oli e tlotsang:2.1 Ntlafatsa boleng le tlholisano ea lihlahisoa;ntlafatsa bophelo bo sebetsang ba lisebelisoa tsa lebokose la lipalangoang;boloka lisebelisoa tsa oli ea mafura2.2 Tšusumetso ea likhohlano e fokotsehile ka 20% -40%.2.3 Ho roala ha sefahleho sa friction ho fokotsehile ka 30% -40%.2.4 Ho kena ka potlako ho friction para.
Hape, nanopowder ea daemane e ka sebelisoa bakeng sa ho sila le ho bentša, joalo-joalo.
Packaging & ShippingMekhoa ea ho romella: TNT, Fedex, DHL, UPS, EMS, joalo-joalo
Lintlha tsa KhampaniGuangzhou Hongwu Material Technology Co., ltd ke katlase ea Hongwu International, 'me lets'oao la HW NANO le qalile ho tloha ka 2002. E 'ngoe ea likhamphani tse etelletseng pele lefatšeng ka bophara tsa ho etsa thepa ea nano le mofani oa thepa.Re thehile theknoloji e tsoetseng pele ea proructin le letoto la lihlahisoa, re sebeletsa bareki ba rona ka lihlahisoa tsa boleng, theko ea tlholisano le tšebeletso e ntle.
Re tsepamisitse maikutlo haholo ho nanometer scale phofo le likaroloana.Re na le mefuta e mengata ea boholo ba likaroloana tsa 10nm ho isa ho 10um, hape re ka etsa mefuta e meng ho latela tlhoko ea bareki.Lihlahisoa tsa rona li arotsoe ka lihlopha tse tšeletseng:
The elemental, mohlala Copper Nanoparticles, Siliconnanoparticles, Silver nanoparticles
Alloy, mohlala, Cu-Zn alloy
Motsoako le oxide, mohlala, CuOnanoparticles, Al2O3 nanopowder
Letoto la carbon, mohlala, phofo ea graphene, phofo ea carbon nanutubes, phofo ea daemane nano
nanowires.mohlala, Cu nanowire