Ag-Cu Silver Copper Alloy Nanoparticles bakeng sa Conductive Paste

Tlhaloso e Khutšoanyane:

Ag-Cu alloy ke conductivity e phahameng ea motlakase le khanyetso ea oxidation. E ka sebelisoa ho peista ea conductive bakeng sa lisebelisoa tsa elektroniki, liporo tsa lebelo le phahameng, likarolo tsa taolo ea makoloi jj.


Lintlha tsa Sehlahisoa

Ag-Cu Silver Copper Alloy Nanoparticles

Tlhaloso:

Lebitso Silver Copper Alloy Nanoparticles
Foromo Ag-Cu
Boholo ba likaroloana 20nm, 50nm, 80nm, 100nm, e ka fetolehang
Bohloeki 99.9%+
Morphology e batlang e le chitja
Ponahalo Ka kakaretso e 'mala o motšo kapa o bosootho ho latela boemo ba silevera
Lisebelisoa tse ka bang teng Ho lokisoa ha solder paste., joalo-joalo.
Bakeng sa lintlha tse ling tsa sehlahisoa, ka kopo ikopanye le rona ka bolokolohi.

Tlhaloso:

Ha nano-silver-copper alloy powder e sebelisoa e le sekontiri sa conductive, chelete ea silevera e ka bolokeha, 'me e molemo ho sireletsa tikoloho.

Packing: Vacuum-packed, mokotla oa anti-static o habeli, 100g, 200g, 500g ka mokotleng kapa kamoo ho hlokahalang

Boemo ba polokelo:

Ag-Cu alloy nanoparticles e lokela ho koaloa ka tlas'a vacuum 'me e lokela ho bolokoa maemong a pholileng le a omileng. Ho kopana le moea ho lokela ho qojoa.

SEM & XRD :

TG AGCU 750

  • E fetileng:
  • E 'ngoe:

  • Re romelle molaetsa oa hau:

    Ngola molaetsa wa hao mona mme o re romele wona

    Re romelle molaetsa oa hau:

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