TDS\Size | 40nm | 70nm | 100nm | 200nm |
Morphology | Spherical | |||
Bohloeki | Metal motheo 99.9% | |||
COA | Bi<=0.003% Sb<=0.001% Joalo ka<=0.002% Sn<=0.001% Fe<=0.006% Ni<=0.005% Pb<=0.001% Zn<=0.002% | |||
SSA(m2/g) | 10-12 | 8-11 | 8-10 | 6-8 |
Boima ba Bongata(g/ml) | 0.19 | 0.20 | 0.21 | 0.22 |
Boima ba 'Nete(g/ml) | 8.9 | 8.9 | 8.9 | 8.9 |
Boholo ba ho paka | 25g, 50g, 100g ka mokotla ka mekotleng e habeli ea antistatic, kapa ha ho hlokahala. | |||
Nako ea thomello | Setokong, se romelloa ka matsatsi a mabeli a mosebetsi. |
E sebetsa joalo ka anti-bayotic, anti-microbial, le anti-fungus ha e eketsoa ho lipolasetiki, lirafshoa le masela.
Litšepe tse matla le li-alloys tse phahameng.
EMI e sireletsa.
Licheso tsa mocheso le lisebelisoa tse tsamaisang mocheso o phahameng haholo.
E sebetsang hantle bakeng sa karabelo ea lik'hemik'hale le bakeng sa motsoako oa methanol le glycol.
Joalo ka li-additives tsa sintering le lisebelisoa tsa capacitor.
Li-inks le li-pastes tse nang le Cu nanoparticles li ka sebelisoa e le sebaka sa litšepe tse theko e boima haholo tse sebelisoang ho elektronike e hatisitsoeng, lipontšo le lits'ebetso tsa lifilimi tse tšesaane tse fetisang.
Ts'ebetso ea ho roala ka holimo ea tšepe ea tšepe le tšepe e seng ferrous.
Ho hlahisa li-electrode tsa ka hare tsa MLCC le likarolo tse ling tsa elektronike ka slurry ea elektronike bakeng sa miniaturization ea lisebelisoa tsa microelectronic.
Joalo ka li-additives tsa nanometal lubricant.
Copper nanoparticles(20nm bta coated Cu) e lokela ho koalloa ka mekotleng ea vacuum.
E bolokiloe ka kamoreng e pholileng le e omileng.
U se ke ua pepeseha moeeng.
Qoba hole le mocheso o phahameng, mehloli ea mollo le khatello ea maikutlo.