Boholo | 20nm | |||
Morphology | Spherical | |||
Bohloeki | motheo oa tšepe 99%+ | |||
COA | C<=0.085% Ca<=0.005% Mn<=0.007% S<=0.016%Si<=0.045% | |||
Lera la ho roala | ha ho letho | |||
Solvent | metsi a betliloeng | |||
Ponahalo | e ntsho ka sebopeho sa kuku e metsi | |||
Boholo ba ho paka | 25g ka mokotla o mong ka mekotleng ea vacuum antistatic, kapa joalo ka ha ho hlokahala. | |||
Nako ea thomello | Setokong, se romelloa ka matsatsi a mabeli a mosebetsi. |
The ka holimo conductive barbotage tshebetso ya tšepe le non-ferrous tšepe;
Setsi sa ts'ebetso e phahameng : Koporo le li-nanoparticles tsa alloy li sebelisoa e le li-catalyst tse nang le bokhoni bo phahameng le khetho e matla.Li ka sebelisoa e le li-catalysts ha ho etsoa methanol ho tloha carbon dioxide le hydrogen.
Cu Nanoparticles e sebelisoang e le liaparo tsa Conductive;Li-inks tsa conductive;Conductive slurry: Nanopowder ea koporo e ka sebelisoa ho hlahisa li-electrode tsa ka hare tsa MLCC le likarolo tse ling tsa elektronike ka slurry ea elektronike bakeng sa miniaturization ea lisebelisoa tsa microelectronic;Boholo ba elektronike bo nang le ts'ebetso e ntle e entsoeng ka nanopowder ea koporo ho e-na le likaroloana tsa tšepe tsa bohlokoa li fokotsa litšenyehelo ka tekanyo e kholo;Theknoloji ena e sebelisetsoa khetho ea mekhoa ea microelectronic;Li-pastes tse tsamaisang.Cu Nanoparticles ke lisebelisoa tse phahameng tsa ho futhumatsa mocheso.
Li-additives tsa Nano Lubricant: Ho eketsa 0.1 ~ 0.6% ea nanopowder ea koporo ho oli ea lubricant le mafura a lubricant.E tla theha filimi ea ho itlotsa le ea ho itokisa sebakeng se ferekaneng le ho theola ts'ebetso ea eona e khahlanong le ho ferekana le e khahlanong le ho apara.
Meriana append lintho tse bonahalang;
Lisebelisoa tsa capacitor;
Copper nanoparticles(20nm bta coated Cu) e lokela ho koalloa ka mekotleng ea vacuum.
E bolokiloe ka phapusing e pholileng le e omileng, e khothalelitsoe ke 0-10 ℃.
U se ke ua pepeseha moeeng.
Qoba hole le mocheso o phahameng, letsatsi le khatello ea maikutlo.