Silicon Carbide Nanoparticles (beta, cubic, 50nm, 99%)

Tlhaloso ea SiC powder:

Boholo ba likaroloana: 50nm, 100-200nm, 0.5um, 1-2um, 5um

Bohloeki: 99%

Mokhahlelo: beta

Silicon Carbide (SiC) Nanoparticles - Thepa, Likopo

Guangzhou Hongwu Material Technology Co., Ltd ke moetsi ea hloahloa le morekisi oa li-nanoparticles tsa Silicon Carbide (SiC) tse nyane bakeng sa bafuputsi le ka tatellano ea bongata bakeng sa lihlopha tsa indasteri.

Silicon carbide (SiC) nanoparticles e bonts'a litšobotsi tse kang conductivity e phahameng ea mocheso, botsitso bo phahameng, bohloeki bo phahameng, ho hanyetsa ho apara hantle le ts'ebetso e nyenyane ea ho atolosa mocheso.Likaroloana tsena li boetse li hanana le oxidation ka mocheso o phahameng.Silicon ke ea Block P, Period 3 ha carbon e le ea Block P, Period 2 ea tafole ea periodic.Ntlha ea bohlokoa e lokelang ho hlokomeloa ka polokelo ea tsona ke hore li tlameha ho behoa hole le mongobo, mocheso le khatello ea maikutlo.

Silicon carbide nanoparticles e hlaha ka sebopeho sa phofo e tala e bohlooho e nang le cubic morphology.

Thepa ea mantlha ea SiC nanoparticles:

Mocheso oa ho Senyeha (K): 2973Matla a ho futhumatsa (KJ / mol): 30.343Linear Katoloso Coefficient (373K): 6.58 * 10-6Linear Katoloso Coefficient (1173K): 2.98 * 10-6

Sic nanoparticles Thermal Conductance:Compression Coefficient: 0.21 * 10-6Boima ba 'mele (288K) (g/cm3): 3.216boima (Mohs): 9.5

Lisebelisoa tsa silicon carbide/sic nanoparticles li fanoe ka tlase:

Joalo ka thepa ea boleng bo holimo ea refractory, thepa e khethehileng ea ho bentša abrasive, likarolo tse fapaneng tsa ceramic, lirafshoa tsa masela le lirafshoa tse phahameng haholo.Ho etsa lithaere tsa rabaraTlhahiso ea lintho tse silang tse nang le boima bo phahamengHo etsa li-valve tsa ho koala tse mamellang mocheso o phahamengResistance heat elementE sebelisoa ho fetola matla a li-alloysMocheso o phahameng oa ho fafatsa nozzleSubstrates bakeng sa ICsLiaparo tsa seipone bakeng sa tikoloho e phahameng ea ultraviolet.

Guangzhou Hongwu Material Technology Co., ltd ke k'hamphani e ka tlase ho Hongwu International, e nang le mofuta oa HW NANO o qalileng ho tloha ka 2002. Re bahlahisi le mofani oa thepa ea nano lefatšeng ka bophara.Khoebo ena ea theknoloji e phahameng e shebane le lipatlisiso le nts'etsopele ea nanotechnology, phetoho ea holim'a phofo le ho hasana le ho fana ka li-nanoparticles, nanopowders le nanowires.

Re araba ka theknoloji e tsoetseng pele ea Hongwu New Materials Institute Co., Limited le Liunivesithi tse ngata, litsi tsa lipatlisiso tsa mahlale lapeng le kantle ho naha, Motheong oa lihlahisoa le lits'ebeletso tse teng, lipatlisiso tsa theknoloji ea tlhahiso le nts'etsopele ea lihlahisoa tse ncha.Re thehile sehlopha sa baenjiniere ba mefuta-futa ba nang le limelo tsa k'hemistri, fisiks le boenjiniere, 'me ba ikemiselitse ho fana ka li-nanoparticles tsa boleng bo phahameng hammoho le likarabo tsa lipotso tsa bareki, matšoenyeho le maikutlo.Re lula re batla litsela tsa ho ntlafatsa khoebo ea rona le ho ntlafatsa mela ea lihlahisoa tsa rona ho fihlela litlhoko tse fetohang tsa bareki.

Sepheo sa rona se seholo ke phofo ea nanometer scale le likaroloana.Re boloka mefuta e mengata ea boholo ba likaroloana bakeng sa 10nm ho isa ho 10um, hape re ka etsa boholo bo eketsehileng ha ho hlokahala.Lihlahisoa tsa rona li arotsoe ka mefuta e tšeletseng ea mefuta e makholo: ea mantlha, alloy, motsoako le oxide, letoto la khabone le nanowires.

Lipotso Tse Botsoang Hangata:

1. O ka nketsetsa qotso/proforma invoice?E, sehlopha sa rona sa thekiso se ka fana ka litheolelo tsa molao bakeng sa hau.Leha ho le joalo, u tlameha ho qala ka ho bolela aterese ea tefiso, aterese ea thomello, aterese ea lengolo-tsoibila, nomoro ea mohala le mokhoa oa ho romella.Re ke ke ra etsa qotso e nepahetseng ntle le tlhahisoleseling ena.

2. O romela odara ea ka joang?A na u ka romela "ho bokella thepa"?Re ka romella odara ea hau ka Fedex, TNT, DHL, kapa EMS akhaonteng ea hau kapa ka tefo ea pele.Re boetse re romella "ho bokella thepa" akhaonteng ea hau.U tla fumana thepa ka mor'a matsatsi a 2-5 a latelang, Bakeng sa lintho tse seng teng, kemiso ea ho fana ka thepa e tla fapana ho latela ntho eo.Ka kopo, ikopanye le sehlopha sa rona sa thekiso ho botsa hore na thepa e teng.

3. Na u amohela liodara tsa theko?Re amohela liodara tsa theko ho tsoa ho bareki ba nang le nalane ea mekoloto ho rona, o ka re fax kapa oa romella odara ea theko ho rona.Ka kopo etsa bonnete ba hore odara ea theko e na le lengolo la lengolo la k'hamphani/setheo le saena e lumelletsoeng ho eona.Hape, o tlameha ho hlakisa motho eo u kopanang le eena, aterese ea thomello, aterese ea lengolo-tsoibila, nomoro ea mohala, mokhoa oa ho romella.

4. Nka lefella otara ea ka joang?Mabapi le tefo, re amohela phetiso ea mohala, western union le PayPal.L/C ke ea theko e fetang 50000USD feela. Kapa ka tumellano, mahlakore ka bobeli a ka amohela lipehelo tsa tefo.Ho sa tsotelehe hore na u khethile mokhoa ofe oa ho lefa, ka kopo re romelle mohala oa banka ka fax kapa lengolo-tsoibila ka mor'a hore u qete ho lefa.

5. Na ho na le litšenyehelo tse ling?Ka holim'a litjeo tsa sehlahisoa le litjeho tsa thomello, ha re lefelle litefiso.

6. O ka etsa sehlahisoa bakeng sa ka?Ehlile.Haeba ho na le nanoparticle eo re se nang eona setokong, ho joalo, ho ka etsahala hore re e hlahisetse uena.Leha ho le joalo, hangata e hloka bonyane ba bongata bo laetsoeng, le nako ea ho etella pele ea libeke tse 1-2.

7. Tse ling.Ho ea ka litaelo tsohle tse khethehileng, re tla buisana le moreki ka mokhoa o loketseng oa ho lefa, ho sebelisana 'moho ho phethahatsa lipalangoang le litšebelisano tse amanang le tsona.