Six kinds of commonly used thermal conductive nanomaterials
1. Nano diomand
Diamond is the material with the highest thermal conductivity in nature, with a thermal conductivity up to 2000 W/(mK) at room temperature, a thermal expansion coefficient of about (0.86±0.1)*10-5/K, and insulation at room temperature.In addition, diamond also has excellent mechanical, acoustic, optical, electrical and chemical properties, which makes it have obvious advantages in heat dissipation of high-power photoelectric devices, which also indicates that diamond has great application potential in heat dissipation field.
2. BN
The crystal structure of the hexahedral boron nitride is similar to that of graphite layer structure. It is a white powder characterized by loose, lubricating, easy absorption and light weight.Theoretical density is 2.29g/cm3, mohs hardness is 2, and chemical properties are extremely stable.The product has high moisture resistance and can be used in nitrogen or argon at temperatures up to 2800℃.It not only has a low thermal expansion coefficient, but also has a high thermal conductivity, is not only a good conductor of heat, but a typical electrical insulator.The thermal conductivity of BN was 730w/mk at 300K.
3. SIC
The chemical property of silicon carbide is stable, and its thermal conductivity is better than other semiconductor fillers, and its thermal conductivity is even greater than metal at room temperature.Researchers from Beijing University of Chemical Technology have studied the thermal conductivity of alumina and silicon carbide reinforced silicone rubber.The results show that the thermal conductivity of silicone rubber increases with the increase of the amount of silicon carbide.With the same amount of silicon carbide, the thermal conductivity of silicon rubber reinforced with small particle size is greater than large particle size.
4. ALN
Aluminum nitride is an atomic crystal and can exist stably at the high temperature of 2200 ℃. With good thermal conductivity and small coefficient of thermal expansion, it is a good heat-resistant impact material.The thermal conductivity of aluminum nitride is 320 W· (m·K) -1, which is close to the thermal conductivity of boron oxide and silicon carbide and more than 5 times that of alumina.
Application direction: thermal silica gel system, thermal plastic system, thermal epoxy resin system, thermal ceramic products.
5. AL2O3
Alumina is a kind of multi-functional inorganic filler, with large thermal conductivity, dielectric constant and better wear resistance, widely used in rubber composite materials, such as silica gel, potting sealant, epoxy resin, plastic, rubber thermal conductivity, thermal conductivity plastic, silicone grease, heat dissipation ceramics and other materials.In practical application, Al2O3 filler can be used alone or mixed with other filler such as AIN, BN, etc.
6. Carbon Nanotubes
The thermal conductivity of carbon nanotubes is 3000 W· (m·K) -1, 5 times that of copper.Carbon nanotubes can significantly improve the thermal conductivity, conductivity and physical properties of rubber, and its reinforcing and thermal conductivity is better than traditional fillers such as carbon black, carbon fiber and glass fiber.
