Inkcazo:
Umzekelo | A035 |
Igama | i-cooper nanoparticles |
Ifomula | Cu |
Inombolo yeCAS. | 7440-50-8 |
Ubungakanani beNcam | 200nm |
Ubunyulu | 99.9% |
Umbuso | umgubo owomileyo, nomgubo omanzi okanye i-dispersions ziyafumaneka |
Imbonakalo | umgubo omnyama |
Iphakheji | 25g, 50g, 100g, 500g, 1kg kwiingxowa eziphindwe kabini ezichasene ne-static |
Usetyenziso olunokwenzeka | i-lubricant, i-conductive, i-catalyst, njl. |
Inkcazo:
Ukusetyenziswa kweenanoparticles zethusi:
I-Metal nano-lubricating additives: yongeza i-0.1 ~ 0.6% kwi-oyile yokuthambisa kunye negrisi ukwenza ifilimu yokuzithambisa kunye nokuzilungisa ngokwayo kumphezulu wesibini sokukhuhla ngexesha lenkqubo yokuxubha, ephucula kakhulu i-anti-wear and anti-friction. ukusebenza kwe friction pair.
Ukunyangwa kwe-conductive coating on the surface of metal and non-metal: I-Nano aluminium, ithusi, i-nickel powder inomgangatho osebenza kakhulu, kwaye inokuthi ifakwe kwiqondo lokushisa elingaphantsi kwendawo yokunyibilika kwepowder phantsi kweemeko ezingenayo i-oxygen.Le teknoloji ingasetyenziselwa ukuveliswa kwezixhobo ze-microelectronic.
I-catalyst esebenzayo: I-Copper kunye ne-alloy nanopowders isetyenziswa njenge-catalysts kunye nokusebenza okuphezulu kunye nokukhetha okunamandla.Zingasetyenziswa njenge-catalysts kwinkqubo yokusabela kwe-carbon dioxide kunye ne-hydrogen kwi-methanol.
I-conductive paste: isetyenziselwa ii-terminals kunye ne-electrodes yangaphakathi ye-MLCC ukuze i-miniaturize izixhobo ze-microelectronic.Ukuyisebenzisa endaweni yomgubo wentsimbi exabisekileyo ukulungiselela iipastes zombane ngokusebenza okuphezulu kunokunciphisa kakhulu iindleko kunye nokwandisa iinkqubo ze-microelectronic.
Izinto ezikrwada zobuninzi bentsimbi ye-nanomaterials: sebenzisa i-inert gas yokukhusela i-powder metallurgy sintering ukulungiselela isambuku sobhedu metal nanocomposite izinto zokwakha.
Imeko yoGcino:
Iinanoparticles zobhedu kufuneka zitywinwe kakuhle, zigcinwe kwi-1-5 ℃ indawo yobushushu obuphantsi.
I-SEM & XRD :