99.99% superfine micron flake conductive umgubo wesilivere

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Iinkcukacha zeMveliso

99.99% superfine micron flake conductive umgubo wesilivere

Inkcazo yeumgubo wesilivere ophetheyo:

1. Ubungakanani beNanoconductive isilivere powder: 20nm / 30-50nm / 50-80nm, 99.99%, spherical

2. I-sub-micronconductive isilivere powder: 0.1um-1um ukwenza ngokwezifiso kulungile

3. IMicronconductive isilivere powder: 1-3um / 3-5um / 5-10um, kufutshane nespherical / flake

I-SEM kunye ne-COA yesuperfine micron flake conductive umgubo wesilivereziyafumaneka kwireferensi yakho.

I-Hongwu International yimveliso yokuqala yobuchwephesha yokuqala yabavelisi besilivere yomgubo.Uluhlu lweemveliso lubandakanya: i-nano antibacterial powder yesilivere, i-conductive flake powder yesilivere, umgubo wesilivere oqaqambileyo, i-conductive ibhola yomgubo wesilivere, i-ultra-fine powder yesilivere, i-oleic acid efakwe kwi-nano powder yesilivere.

Kukho iziphumo zovavanyo zibonisa ukuba i-composite conductive paste yesilivere ilungiswa ngokusebenzisa i-epoxy resin njenge-agent yokudibanisa, i-ultrafine powder yesilivere njenge-conductive filler kunye ne-polyethylene glycol njenge-additive.Intlama yesilivere ineempawu zokukwazi ukunyanga kwiqondo lobushushu begumbi, ukuhanjiswa okuphezulu kunye nezinto eziguquguqukayo eziphezulu zezinto eziphilayo emva kokunyanga, kwaye zingasetyenziswa kuzo zonke itekhnoloji ye-elektroniki eprintiweyo ye-inki eqhubayo.

Ukukhetha umgubo wesilivere wezinto ezixutyiweyo zomqhubi wepolymerI-1, ipeyinti eqhubayoKwi-conditive coating, i-powder yesilivere ukongeza kwiimpawu eziqhelekileyo zomzimba kunye neekhemikhali, ukuxutywa kweoli, iipropati zokongeza umphezulu, umbala yimilinganiselo ebalulekileyo.2, intlama conductiveKwi-RFID nano-silver powder dispersion, ukukhuselwa kwe-electromagnetic kunye nezinye iimfuno zobushushu obuphantsi bokumisa ngokukhawuleza kwe-slurry (iqondo lokushisa lokumisa <120 ℃, ixesha lokumisa <20min), isilivere kufuneka ikhethwe phezulu.Umgubo wesilivere oqhubayo.Kuba iqondo lobushushu ukomisa kunye nexesha 130 ℃ ~ 140 ℃ / 30min ~ 40min polymer intlama conductive.Umxholo wesilivere ophantsi (<50 wt%)Kufuneka kukhethwe uchungechunge lwesilivere yeflake.Umxholo wesilivere ophakathi (50-60wt%) kufuneka usetyenziswe umgubo wesilivere oqaqambileyo, ukomisa ukuhanjiswa kwefilimu kunye nokunamathela kuxhomekeke kwifilimu yokumisa.Uluhlu lwesilivere kunye ne-resin kwi-volume ratio kunye nokunciphisa, ngoko ke ukuqwalasela isilivere epheleleyo kunye ne-resin weight ratio adjustment.I-3, i-adhesive conductiveI-powder yesilivere njengeyona nto iphambili ye-adhesive adhesive, echaphazela inkqubo yokunamathela (i-rheology, i-thixotropy, i-fineness, iimeko zokuphilisa, njl.).Imveliso ephilisiweIimpawu zomzimba kunye neekhemikhali (i-conductivity, i-thermal conductivity, amandla okubambelela);ukuthembeka kwezinto eziphilisiweyo (kushushu kunye nokufumileyo, impembelelo ephezulu kunye nesezantsi yobushushu).

Ukupakishwa kwepowder yesilivere eqhubayo: iingxowa ezimbini ezichasene ne-static okanye iidramu

Inkonzo ye superfine micron flake conductive umgubo wesilivere

Ulwazi lweNkampani yesuperfine micron flake conductive umgubo wesilivere:

I-Guangzhou Hongwu Material Technology Co., i-ltdis iNkampani ye-Nanotechnology eyenza i-nanoparticles ukususela ngo-2002, ngaphezu kweminyaka eyi-15, sihlala siphuhlisa ama-nanomaterial amatsha ngokusekelwe kwizicelo zeshishini kunye noluhlu lobungakanani besuntswana esilunikezayo yi-10nm-10um.

Sinokwenza i-nanomaterials kwiimfuno ezikhethekileyo ze-cusstmer, kubandakanywa ubungakanani obukhethekileyo be-particle, ukusabalalisa, ukugubungela, ukuguqulwa komphezulu, i-SSA ekhethekileyo, i-AD, imfuno njl.

I-powder yesilivere yenye yezona zinto zixhaphakileyo kwimveliso yethu, sinenkqubo yokuvelisa kunye nezinzile kunye neteknoloji, kwaye sinolawulo olulungileyo kubukhulu bamasuntswana.

Umgangatho olungileyo, ixabiso lefektri kunye nenkonzo yeprofessinal ihlala inikezelwa kwintsebenziswano yexesha elide lokuwina!

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