TDS\ubungakanani | 40nm | 70nm | 100nm | 200nm |
Imorphology | I-Spherical | |||
Ubunyulu | Isiseko sesinyithi 99.9% | |||
I-COA | Bi<=0.003% Sb<=0.001% As<=0.002% Sn<=0.001% Fe<=0.006% Ni<=0.005% Pb<=0.001% Zn<=0.002% | |||
I-SSA(m2/g) | 10-12 | 8-11 | 8-10 | 6-8 |
Ubuninzi bobuninzi (g/ml) | 0.19 | 0.20 | 0.21 | 0.22 |
Ubuninzi bokwenyani(g/ml) | 8.9 | 8.9 | 8.9 | 8.9 |
Ubungakanani bokupakisha | 25g, 50g, 100g ingxowa nganye kwiingxowa kabini antistatic, okanye njengoko kufuneka. | |||
Ixesha lokuzisa | Kwisitokhwe, ukuthunyelwa ngeentsuku ezimbini zomsebenzi. |
Isebenza njenge-anti-biotic, i-anti-microbial, kunye ne-anti-fungal agent xa yongezwa kwiiplastiki, iingubo kunye nempahla.
Amandla aphezulu esinyithi kunye ne-alloys.
EMI ukukhusela.
Iisinki zobushushu kunye nezixhobo zokuqhuba ezishushu kakhulu.
I-catalyst esebenzayo yokuphendula kweekhemikhali kunye ne-synthesis ye-methanol kunye ne-glycol.
Njengezongezo ze-sintering kunye nezixhobo ze-capacitor.
Ii-inks zokuqhuba kunye neepasti eziqulethe i-Cu nanoparticles zingasetyenziselwa indawo yesinyithi esinexabiso eliphezulu kakhulu esisetyenziswe kwi-electronics eprintiweyo, imiboniso, kunye nezicelo zefilimu ezigqithisiweyo ezigqithisiweyo.
Ukucutshungulwa kokugquma okungaphezulu kwentsimbi kunye nentsimbi engeyiyo.
Ukuveliswa kwe-electrode yangaphakathi ye-MLCC kunye namanye amacandelo e-elektroniki kwi-slurry ye-elektroniki ukwenzela ukuba i-miniaturization yezixhobo ezincinci ze-microelectronic.
Njengezongezo ze-nanometal lubricant.
Iinanoparticles zobhedu (20nm bta coated Cu) kufuneka zitywinwe kwiingxowa zokufunxa.
Igcinwe kwigumbi elipholileyo nelomileyo.
Musa ukuba sesichengeni somoya.
Gcina kude nobushushu obuphezulu, imithombo yokutshisa kunye noxinzelelo.