Cubic (Beta) SiC powder sub-micron ubukhulu 0.5um for conductive thermal

Inkcazelo emfutshane:

I-Silicon carbide ineempawu zokumelana nokugqwala, ukumelana nobushushu obuphezulu, amandla aphezulu, i-conductivity efanelekileyo ye-thermal, ukuchasana kwempembelelo, njl. Ngelo xesha, ineenzuzo ze-conductivity ephezulu ye-thermal, ukumelana ne-oxidation, kunye nokuzinza okulungileyo kwe-thermal.


Iinkcukacha zeMveliso

Cubic (Beta) SiC Powder Sub-Micron Ubungakanani 0.5um for Thermal Conductive

Ubungakanani 0.5um
Uhlobo Cubic ( Beta )
Ubunyulu 99%
Imbonakalo umgubo oluhlaza ongwevu
Ubungakanani bokupakisha 1kg/bag, 20kg/drum.
Ixesha lokuzisa kuxhomekeke kubungakanani

Inkcazo eneenkcukacha

Izixhobo zePolymer zinezibonelelo zokuxinana okuphantsi, ukusetyenzwa lula, kunye nokugquma kombane okulungileyo.Zisetyenziswa kakhulu kwimimandla enje ngokudityaniswa kwe-microelectronics kunye nokupakishwa, oomatshini bombane, kunye nokonga amandla e-LED.Ngokuqhelekileyo, iipolima ziziqhubi ezingalunganga zobushushu.Ngokubhekiselele kwizinto zokugquma i-insulating, umthamo wabo wokutshatyalaliswa kobushushu uba yingxaki ye-bottleneck, kwaye kukho imfuneko engxamisekileyo yokulungiselela izinto ezidibeneyo ze-polymer conductivity ze-thermal ezineempawu ezigqwesileyo.

I-Silicon carbide ineempawu zokumelana nokugqwala, ukumelana nobushushu obuphezulu, amandla aphezulu, i-conductivity efanelekileyo ye-thermal, ukuchasana kwempembelelo, njl. Ngelo xesha, ineenzuzo ze-conductivity ephezulu ye-thermal, ukumelana ne-oxidation, kunye nokuzinza okulungileyo kwe-thermal.

Abaphandi basebenzise i-silicon carbide njenge-thermal conductive filler yokuzalisa i-epoxy, kwaye bafumanisa ukuba i-nano-silicon carbide inokukhuthaza ukunyangwa kwe-epoxy resin, kunye namasuntswana e-silicon carbide kunokwenzeka ukuba enze indlela yokuqhuba i-thermal okanye ikhonkco lenethiwekhi ye-thermal ngaphakathi kwenkqubo ye-resin. , ukunciphisa umlinganiselo we-void wangaphakathi we-epoxy resin kunye nokuphucula i-epoxy resin.I-mechanical conductivity kunye ne-thermal conductivity yezinto eziphathekayo.

Ezinye izifundo zisebenzise i-agent yokudibanisa i-silane, i-asidi ye-stearic kunye nokudibanisa kwabo njenge-modifiers ukufunda imiphumo ye-modifiers eyahlukeneyo kumxholo oqinileyo, ixabiso le-oyile yokuxutywa kunye ne-thermal conductivity ye-β-SiC powder.Iziphumo zovavanyo zibonisa ukuba umphumo wokuguqulwa kwe-KH564 kwi-agent yokudibanisa i-silane ibonakala ngakumbi;ngophononongo lwe-asidi ye-stearic kunye nokudityaniswa kwezilungiso ezimbini zomphezulu, iziphumo zibonisa ukuba umphumo wokuguqulwa uphuculwe ngakumbi xa kuthelekiswa nesilungisi esinye, kwaye ukuqina kuphezulu.Umphumo we-fatty acid kunye ne-KH564 ungcono, kwaye i-thermal conductivity ifikelela kwi-1.46 W / (m · K), eyi-53.68% ephezulu kune-β-SiC engaguqukiyo kunye ne-20.25% ephezulu kuneyo yokuguqulwa kwe-KH564 enye.

Ngaphezulu kwireferensi yakho kuphela, iinkcukacha ziya kufuna uvavanyo lwakho, enkosi.


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