TDS\ubungakanani | Cu 300nm; Cu500nm; Cu800nm | |||
Inombolo yeCAS | 7440-50-8 | |||
Imorphology | I-Spherical | |||
Ubunyulu | isiseko sesinyithi 99% + | |||
Imbonakalo | Ubhedu Olubomvu | |||
Indawo ethile yoMphezulu (BET) | 1-4m2 / g adjustable | |||
Ubungakanani bokupakisha | 100g, 500g, 1kg ingxowa nganye kwiingxowa antistatic kabini, okanye njengoko kufuneka. | |||
Ixesha lokuzisa | Kwisitokhwe, ukuthunyelwa ngeentsuku ezimbini zomsebenzi. |
Isebenza njenge-anti-biotic, i-anti-microbial, kunye ne-anti-fungal agent xa yongezwa kwiiplastiki, iingubo kunye nempahla.
Amandla aphezulu esinyithi kunye ne-alloys.
EMI ukukhusela.
Iisinki zobushushu kunye nezixhobo zokuqhuba ezishushu kakhulu.
I-catalyst esebenzayo yokuphendula kweekhemikhali kunye ne-synthesis ye-methanol kunye ne-glycol.
Njengezongezo ze-sintering kunye nezixhobo ze-capacitor.
Ii-inks zokuqhuba kunye neepasti eziqulethe i-Cu nanoparticles zingasetyenziselwa indawo yesinyithi esinexabiso eliphezulu kakhulu esisetyenziswe kwi-electronics eprintiweyo, imiboniso, kunye nezicelo zefilimu ezigqithisiweyo ezigqithisiweyo.
Ukucutshungulwa kokugquma okungaphezulu kwentsimbi kunye nentsimbi engeyiyo.
Ukuveliswa kwe-electrode yangaphakathi ye-MLCC kunye namanye amacandelo e-elektroniki kwi-slurry ye-elektroniki ukwenzela ukuba i-miniaturization yezixhobo ezincinci ze-microelectronic.
Njengezongezo ze-nanometal lubricant.
Iinanoparticles zobhedu (20nm bta coated Cu) kufuneka zitywinwe kwiibhegi zevacuum.
Igcinwe kwigumbi elipholileyo nelomileyo.
Musa ukuba sesichengeni somoya.
Gcina kude nobushushu obuphezulu, imithombo yokutshisa kunye noxinzelelo.