I-Ultrafine Submicro 99.99% yeePowders zeSiliva zeSiliva zokusetyenziswa okuqhubekileyo

Inkcazelo emfutshane:

Isilivere ye-conductive yomgubo ocolekileyo yeyona nto iphambili ekrwada yokuncamathelwa kwe-elektroniki, intlama yesilivere eqhubayo, i-LED epoxy encamathelayo encamathelayo, i-electromagnetic shielding coating, i-conductive coating, i-inki eqhubayo, irabha eqhubayo, iplastiki eqhubayo, iiseramikhi eziqhubayo njalo njalo.I-CAS 7440-22-4.IXABISO LEFACTORY & NOKUTHUMELA NGENQANABA KWIHLABATHI LONKE.


Iinkcukacha zeMveliso

Ukucaciswa komgubo wesilivere wesubmicro (Ag)

MF

Ubungakanani beNcam

(SEM)

Ubuninzi bobuninzi (g/ml)

Uxinaniso lweTephu(g/ml)

I-SSA(BET)m2/g

I-Morphology

Amanqaku

Ag

200nm, 500nm, 800nm

0.50-2.00

1.50-5.00

0.50-2,50

I-Spherical

Customized ziyafumaneka

COA Bi<=0.008% Cu<=0.003% Fe<=0.001% Pb<=0.001%Sb<=0.001% Se<=0.005% Te<=0.005% Pd<=0.001%

Usetyenziso oluqhelekileyo

Iyaqhuba
Iseli yeSolar
I-Catalyst
Iyaqhuba

Ii-Composites eziqhubayo
Iinanoparticles zesilivere ziqhuba umbane kwaye zihlakazeka ngokulula nakweliphi na inani lezinye izinto.Ukongeza i-nanoparticles yesilivere kwizinto ezifana ne-pastes, i-epoxies, i-inki, iiplastiki, kunye nezinye iindidi ezahlukeneyo zokudibanisa umbane kunye ne-thermal conductivity.

1. Intlama yesilivere yomgangatho ophezulu (iglu) :

Namathisela (iglue) kwi-electrodes yangaphakathi nangaphandle yamacandelo e-chip;

Ncamathelisa (iglu) kwifilimu eshinyeneyo edibeneyo yesekethe;

Ncamathisela (iglu) kwi-electrode yeseli yelanga;

I-conductive yesilivere ye-paste ye-chip ye-LED.

2. I-Coductive Coating

Isihluzi esinomgangatho ophezulu wokugquma;

I-porcelain tube capacitor ene-coating yesilivere

Ubushushu obuphantsi be-sintering paste conductive;

Intlama yeDielectric

Iseli yeSolar

Umkhombandlela wophuhliso lwexesha elizayo kwimarike yeeseli zelanga:

Ikakhulu isebenzisa itekhnoloji ye-silicon emnyama yedayimane kunye netekhnoloji yePERC.

I-sub-micron yesilivere ye-Hongwu ye-powder---ngokulawulwa kobungakanani be-particle size, i-slurry kwinkqubo ye-sintering inokuzaliswa ngokukhawuleza kwi-gap ye-silicon emnyama, ukwenzela ukuba kube lula ukwenza umnxibelelwano olungileyo.

Kwangaxeshanye, ngenxa yokunciphisa ubungakanani bamasuntswana, iqondo lobushushu lokunyibilika komgubo wesilivere kwinkqubo ye-sintering nayo iyancipha, ehambelana neemfuno zetekhnoloji ye-PERC yokunciphisa kakhulu inkqubo yobushushu be-sintering.

I-Catalyst

Iinanoparticles zesilivere zinomsebenzi ogqwesileyo we-catalytic kwaye zinokusetyenziswa njengezinto ezibangela ukusabela okuninzi.Iinanoparticles ezihlanganisiweyo ze-Ag/ZnO zalungiswa ngokufakwa kwefotoreduction yesinyithi esixabisekileyo.I-photocatalytic oxidation yesigaba segesi i-n-heptane isetyenziswe njengempendulo yomzekelo wokufunda imiphumo ye-photocatalytic umsebenzi weesampuli kunye nesixa se-metal deposition ehloniphekileyo kumsebenzi we-catalytic.Iziphumo zibonisa ukuba ukufakwa kwe-Ag kwi-ZnO nanoparticles kunokuphucula kakhulu umsebenzi we-photocatalyst.
Ukunciphisa i-p - nitrobenzoic acid kunye ne-nanoparticles yesilivere njenge-catalyst.Iziphumo zibonisa ukuba iqondo lokunciphisa i-p-nitrobenzoic acid kunye ne-nano-silver njenge-catalyst inkulu kakhulu kunokuba ngaphandle kwe-nano-silver.Kwaye, ngokunyuka kwenani le-nano-silver, ngokukhawuleza ukusabela, ukusabela okupheleleyo.I-ethylene oxidation catalyst, i-catalyst yesilivere exhaswayo kwiseli yamafutha.

Ingxelo yoMthengi


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