Ukucaciswa:
Igama | I-Silver Copper Alloy Nanoparticles |
Ifomula | Ag-Cu |
Izinhlayiya Osayizi | 20nm, 50nm, 80nm, 100nm, eshintshwayo |
Ubumsulwa | 99.9%+ |
I-Morphology | cishe iyindilinga |
Ukubukeka | Ngokuvamile kuba mnyama noma ngokuphuzi kuya ngokuqukethwe okuyisiliva |
Izinhlelo zokusebenza ezingaba khona | Ukulungiswa kwe-solder paste., njll. Ukuze uthole imininingwane eyengeziwe yomkhiqizo, sicela usithinte ngokukhululekile. |
Incazelo:
Lapho i-nano-silver-copper alloy powder isetshenziswa njenge-conductive paste, inani lesiliva lingagcinwa, futhi linenzuzo ekuvikelweni kwemvelo.
Ukupakisha: I-vacuum-packed, isikhwama sokulwa ne-static-layer kabili, 100g, 200g, 500g esikhwameni noma njengoba kudingeka
Isimo Sesitoreji:
I-Ag-Cu alloy nanoparticles kufanele ivalwe ngaphansi kwe-vacuum futhi kufanele igcinwe ezimweni ezipholile nezomile.Ukuthintana emoyeni kufanele kugwenywe.
I-SEM ne-XRD :