TDS\Usayizi | 40nm | 70nm | 100nm | 200nm |
I-Morphology | I-Spherical | |||
Ubumsulwa | Isisekelo sensimbi 99.9% | |||
I-COA | Bi<=0.003% Sb<=0.001% As<=0.002% Sn<=0.001% Fe<=0.006% Ni<=0.005% Pb<=0.001% Zn<=0.002% | |||
I-SSA(m2/g) | 10-12 | 8-11 | 8-10 | 6-8 |
Ukuminyana kwenqwaba(g/ml) | 0.19 | 0.20 | 0.21 | 0.22 |
Ukuminyana Kwangempela(g/ml) | 8.9 | 8.9 | 8.9 | 8.9 |
Usayizi wokupakisha | 25g, 50g, 100g isikhwama ngasinye ezikhwameni double antistatic, noma njengoba kudingeka. | |||
Isikhathi sokuthumela | Esitokweni, kuthunyelwa ngezinsuku ezimbili zokusebenza. |
Isebenza njenge-anti-biotic, i-anti-microbial, kanye ne-ejenti elwa nokukhunta uma yengezwa kumapulasitiki, okokunamathela, nezindwangu.
Izinsimbi ezinamandla aphezulu nama-alloys.
Ukuvikela i-EMI.
Osinki okushisa nezinto ezishisayo ezishisayo.
I-catalyst ephumelelayo yokusabela kwamakhemikhali kanye nokuhlanganiswa kwe-methanol ne-glycol.
Njengezithako ze-sintering kanye nezinto ze-capacitor.
Oyinki abasebenzayo nama-paste aqukethe ama-Cu nanoparticles angasetshenziswa esikhundleni sezinsimbi ezibiza kakhulu ezisetshenziswa kumishini kagesi ephrintiwe, izibonisi, kanye nezinhlelo zokusebenza zefilimu elincanyana.
I-Superficial conductive coating processing yensimbi nensimbi engeyona ayoni.
Ukukhiqizwa kwe-electrode yangaphakathi ye-MLCC nezinye izingxenye ze-elekthronikhi ku-slurry ye-elekthronikhi ukuze kusetshenziswe i-miniaturization yamadivayisi we-microelectronic.
Njengezithasiselo ze-nanometal lubricant.
Ama-nanoparticles ethusi(20nm bta coated Cu) kufanele afakwe uphawu ezikhwameni ze-vacuum.
Igcinwe ekamelweni elipholile nelomile.
Ungachayeka emoyeni.
Gcina kude nezinga lokushisa eliphezulu, imithombo yokuthungela nokucindezeleka.