I-conductive adhesive iyingcina ekhethekile, ehlanganiswe ikakhulukazi ne-resin kanye nesigcwalisi esisebenzayo (njengesiliva, igolide, ithusi, i-nickel, i-tin nama-alloys, i-carbon powder, i-graphite, njll.), engasetshenziselwa ukuhlanganisa ezingxenyeni ze-microelectronic kanye nokukhiqiza ukupakisha. izinto zokwakha.

Kunezinhlobo eziningi ze-adhesive conductive.Ngokusho kwezinhlayiya ezihlukene zokuqhuba, ama-adhesive conductive angahlukaniswa abe yinsimbi (igolide, isiliva, ithusi, i-aluminium, i-zinc, insimbi, i-nickel powder) -based based and carbon-based conductive adhesives.Phakathi kwezinamatheliso ezingenhla ezingenhla, i-conductive adhesive synthesized by silver powder ine-conductivity enhle kakhulu, ukunamathela kanye nokuzinza kwamakhemikhali, ngeke kufakwe i-oxidized ongqimbeni olunamathelayo, futhi izinga le-oxidation emoyeni nalo lihamba kancane kakhulu ngisho noma lifakwe i-oxidized. i-silver oxide ekhiqiziwe isenayo i-conductivity enhle.Ngakho-ke, emakethe, ikakhulukazi kumadivayisi kagesi anezidingo zokuthembeka okuphezulu, ama-adhesive conductive ane-powder esiliva njengama-filler conductive asetshenziswa kakhulu.Ekukhetheni i-matrix resin, i-epoxy resin isibe yisinqumo sokuqala ngenxa yokuqukethwe kwayo okuphezulu kwamaqembu asebenzayo, amandla aphezulu okuhlangana, ukunamathela okuhle, izakhiwo ezinhle kakhulu zemishini, kanye nezakhiwo ezinhle kakhulu zokuhlanganisa.

Niniisiliva powderyengezwa ku-epoxy adhesive njengesigcwalisi esiqhubayo, indlela yayo yokuqhuba iwukuxhumana phakathi kwezimpushana zesiliva.Ngaphambi kokuba i-adhesive conductive ilashwe futhi yomiswe, i-powder yesiliva ku-adhesive epoxy ikhona ngokuzimela futhi ayibonisi ukuthintana okuqhubekayo komunye nomunye, kodwa isesimweni esingenayo i-conductive ne-insulating.Ngemuva kokuphulukisa nokomisa, ngenxa yokuphulukiswa kwesistimu, ama-powders esiliva axhunywe komunye nomunye ngendlela yeketanga ukuze enze inethiwekhi ye-conductive, ebonisa ukuhamba.Ngemuva kokwengeza i-powder yesiliva ku-adhesive epoxy ngokusebenza kahle (inani le-ejenti eqinisayo kanye ne-ejenti yokwelapha yi-10% kanye ne-7% ye-epoxy resin mass, ngokulandelanayo), ukusebenza kuhlolwa ngemva kokuphulukiswa.Ngokusho kwedatha yokuhlola, njengoba inani lokugcwalisa lesiliva ku-adhesive conductive likhuphuka, ukuphikiswa kwevolumu kuncipha kakhulu.Lokhu kungenxa yokuthi lapho okuqukethwe kwe-powder esiliva kukuncane kakhulu, inani le-resin ohlelweni likhulu kakhulu kunele-conductive filler powder powder, futhi i-powder yesiliva kunzima ukuyithinta ukuze yenze inethiwekhi ye-conductive ephumelelayo, ngaleyo ndlela ikhombisa ukumelana okuphezulu. .Ngokukhuphuka kwenani lokugcwalisa i-powder yesiliva, ukwehla kwe-resin kukhulisa ukuthintana kwe-powder yesiliva, okuzuzisa ukwakheka kwenethiwekhi yokuhambisa futhi kunciphisa ukumelana nevolumu.Uma inani lokugcwalisa lingu-80%, ukuphikiswa kwevolumu kungu-0.9 × 10-4Ω•cm, okunokuziphatha okuhle, i-FYI.

Izimpushana zesilivangosayizi wezinhlayiyana oguquguqukayo (kusuka ku-20nm-10um), ubujamo obuhlukene (i-spherical, eduze-spherical, flake) kanye nensizakalo eyenziwe ngezifiso yokuminyana, i-SSA, njll.

Ukuze uthole ulwazi olwengeziwe, sicela ungangabazi ukusithinta.