TDS\Usayizi | Ku-300nm;Cu500nm;Cu800nm | |||
Inombolo ye-CAS | 7440-50-8 | |||
I-Morphology | I-Spherical | |||
Ubumsulwa | isisekelo sensimbi 99%+ | |||
Ukubukeka | I-Copper Red | |||
Specific Surface Area (BET) | 1-4m2/g elungisekayo | |||
Usayizi wokupakisha | 100g, 500g, 1kg isikhwama ngasinye ezikhwameni double antistatic, noma njengoba kudingeka. | |||
Isikhathi sokuthumela | Esitokweni, kuthunyelwa ngezinsuku ezimbili zokusebenza. |
Isebenza njenge-anti-biotic, i-anti-microbial, kanye ne-ejenti elwa nokukhunta uma yengezwa kumapulasitiki, okokunamathela, nezindwangu.
Izinsimbi ezinamandla aphezulu nama-alloys.
Ukuvikela i-EMI.
Osinki okushisa nezinto ezishisayo ezishisayo.
I-catalyst ephumelelayo yokusabela kwamakhemikhali kanye nokuhlanganiswa kwe-methanol ne-glycol.
Njengezithako ze-sintering kanye nezinto ze-capacitor.
Oyinki abasebenzayo nama-paste aqukethe ama-Cu nanoparticles angasetshenziswa esikhundleni sezinsimbi ezibiza kakhulu ezisetshenziswa kumishini kagesi ephrintiwe, izibonisi, kanye nezinhlelo zokusebenza zefilimu elincanyana.
I-Superficial conductive coating processing yensimbi nensimbi engeyona ayoni.
Ukukhiqizwa kwe-electrode yangaphakathi ye-MLCC nezinye izingxenye ze-elekthronikhi ku-slurry ye-elekthronikhi ukuze kusetshenziswe i-miniaturization yamadivayisi we-microelectronic.
Njengezithasiselo ze-nanometal lubricant.
Ama-nanoparticles ethusi(20nm bta coated Cu) kufanele afakwe uphawu ezikhwameni ze-vacuum.
Igcinwe ekamelweni elipholile nelomile.
Ungachayeka emoyeni.
Gcina kude nezinga lokushisa eliphezulu, imithombo yokuthungela nokucindezeleka.